About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
2026 Technical Division Student Poster Contest
|
| Presentation Title |
SPU-48: Structure and Mechanical Behavior of Novel Ternary Cu-Based Intermetallic Compounds |
| Author(s) |
Wyeth H. Haddock, Sarshad Rommel, Drew Cietek, Rainer Hebert, Mark Aindow, Seok-Woo Lee |
| On-Site Speaker (Planned) |
Wyeth H. Haddock |
| Abstract Scope |
The high strength and thermal stability of B2 intermetallics make them promising for high-temperature structural applications, yet most suffer from poor ductility due to limited slip systems and low dislocation mobility. Here, we report a ternary CuDyY B2 intermetallic and its compositional derivatives with enhanced strength and ductility. Transmission electron microscopy and X-ray diffraction confirm that Cu50Dy25Y25 forms an atypical ternary B2 structure, with Cu occupying the α sublattice and Dy and Y randomly distributed on the β sublattice. This alloy exhibits over 30% compressive ductility and a yield strength of ~275MPa, with plastic deformation governed by dislocation slip and martensitic transformation. Increasing the Dy and Y contents to Cu33Dy33Y33 results in a 50% increase in strength while maintaining ductility through the coexistence of the B2 phase and other secondary phases. These results demonstrate that compositional tuning enables optimization of mechanical properties in CuDyY intermetallics while maintaining ductility. |
| Proceedings Inclusion? |
Undecided |
| Keywords |
Mechanical Properties, High-Entropy Alloys, Characterization |