About this Abstract |
| Meeting |
2027 TMS Annual Meeting & Exhibition
|
| Symposium
|
Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXVI
|
| Presentation Title |
Bonding ability of direct Ag nanostructures formed by metal-organic decomposition |
| Author(s) |
Chuncheng WANG, Hiroaki Tatsumi, Hiroshi Nishikawa |
| On-Site Speaker (Planned) |
Hiroshi Nishikawa |
| Abstract Scope |
The bonding process using Ag nanoparticles is a popular technique for the die bonding of power devices. The presence of organic compounds in Ag nanoparticle paste can significantly impact the bonding performance during the bonding process. To address this issue, organic-free Ag nanostructures derived from the thermal decomposition of an Ag-based complex were investigated as an alternative to conventional Ag nanoparticle paste. In this study, the Ag nanostructures were first created by thermally decomposing an Ag-based complex on electroless nickel/immersion gold Cu substrates at 180°C for 30 min. The Ag nanostructures exhibited excellent sintering performance among them, resulting in Ag joints with a high shear strength of 35.8 MPa after bonding at 200 oC with 5 MPa for 10 min. Then, the influence of thermal decomposition time on the joint performance of Ag nanostructures was investigated. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Electronic Materials, Joining, |