About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
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| Symposium
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Electronic Packaging and Interconnection Materials III
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| Presentation Title |
Effect of Ag Addition on Microstructure and Solidification Behavior of Sn-0.7Cu Lead-Free Solder |
| Author(s) |
Chieh Pu Tsai, Cheng-Yi Liu |
| On-Site Speaker (Planned) |
Chieh Pu Tsai |
| Abstract Scope |
With the increasing demand for AI applications, fine-pitch development and chip stacking have become essential for enhancing signal transmission. Lead-free solder is widely used for interconnection in chip packaging. The microstructure of the solder plays a critical role in determining its properties, which directly impact product reliability, including electromigration, thermal cycling, and mechanical shear forces. Therefore, it is valuable to investigate the solidification behavior of the solder. In this study, the microstructure and grain morphology of Sn-0.7Cu solder were examined using polarized optical microscopy (POM) with the addition of various Ag contents. The results show that Sn-0.7Cu solder exhibits a polycrystalline structure with random grain orientations after solidification. However, when Ag is added, a beach ball-like morphology or even a single-crystalline structure can form. Furthermore, the undercooling of Sn-0.7Cu solder with different Ag contents was analyzed by DSC. The solidification behavior of Sn-Ag-Cu solder are further explored in this investigation.
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| Proceedings Inclusion? |
Planned: |
| Keywords |
Solidification, Electronic Materials, Characterization |