About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Precipitation mechanisms in Sn-Bi low temperature solder |
| Author(s) |
Christopher M. Gourlay, Xiaomei Shen, Siyang Wang |
| On-Site Speaker (Planned) |
Christopher M. Gourlay |
| Abstract Scope |
Eutectic Sn-Bi solders are used increasingly as low temperature solders to minimise dynamic warpage and protect temperature-sensitive electronics. However, there remain many aspects of microstructure formation and stability that remain incompletely understood. This presentation will overview research on the solid-state precipitation of bismuth in Sn-58Bi, combining in-situ imaging and diffraction with microstructure analysis after phase transformations. We will compare solid-state bismuth precipitation within tin dendrites versus within eutectic tin, and explore how bismuth precipitation depends on the microstructural length scale created by solidification. We will then overview how bismuth precipitation affects other aspects of microstructure evolution. Finally, the differences in bismuth precipitation in Sn-Bi low temperature solders versus in Sn-Ag-Cu-Bi high reliability solders published previously will be discussed. |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Phase Transformations, Electronic Materials, Characterization |