|About this Abstract
||Materials Science & Technology 2019
||Powder Metallurgy of Light, Reactive and Other Non-ferrous Metals
||P2-68: Creep Compaction of Nanocrystalline Copper Powder
||Nathan Palmerio, Kexiang Zhao, Lynnora Grant, Zachary Cordero
|On-Site Speaker (Planned)
Nanocrystalline metals can exhibit rapid creep at low homologous temperatures; however, they often have creep rates that deviate strongly from those expected based on classical models of boundary-mediated diffusional creep. In this work we investigated the creep behavior of nanocrystalline copper, using constant load creep compaction experiments on copper powders made with high energy ball milling. By comparing the creep rates at different test temperatures, we measured a creep activation energy of ~56 kJ/mol, which is a significantly less than the reported activation energy for grain boundary diffusion in Cu, suggesting a novel deformation process controls low-temperature creep compaction in ball milled nanocrystalline powders.