About this Abstract |
| Meeting |
2026 TMS Annual Meeting & Exhibition
|
| Symposium
|
Electronic Packaging and Interconnection Materials III
|
| Presentation Title |
Zone-Based Thermo-Mechanical Gradient Mapping in Cu–Cu Bonded 3D Stacked Die Packages for Reliability Analysis |
| Author(s) |
Yong Jie Wong, Mohd Sharizal Abdul Aziz, Chu Yee Khor, Kim Hoey Yeoh, Chze Shen Ang, Teng Hwang John Tan |
| On-Site Speaker (Planned) |
Mohd Sharizal Abdul Aziz |
| Abstract Scope |
In vertically stacked die architectures with direct Cu–Cu bonding, localized mechanical and thermal gradients play a critical role in interconnect reliability under thermal cycling. Traditional global warpage or average energy metrics often fail to capture spatial amplification effects that drive early failures. This study introduces a zone-based thermo-mechanical gradient framework for a 3D stacked die structure with two silicon dies connected by a 35×35 copper pillar array. Copper pillar height (10–30 µm) is parametrically varied to assess its influence on stress distribution and energy localization under JEDEC JESD22-A104D thermal cycling. The array is segmented into center, mid-array, and edge zones, reflecting distinct constraint conditions. Stress Amplification Index, Strain Localization Index, and Energy Gradient Index are applied to quantify deviations from global behavior. The results provide insight into height-dependent gradient transitions, supporting interconnect geometry optimization and layout-aware design for advanced Cu–Cu bonded packaging in next-generation electronics |
| Proceedings Inclusion? |
Planned: |
| Keywords |
Modeling and Simulation, Joining, Electronic Materials |