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Meeting 2026 TMS Annual Meeting & Exhibition
Symposium Thermodynamics and Kinetics of Alloys IV
Presentation Title Real-Time Imaging and Correlative Microscopy to Probe Mechanisms of Solidification and Thermal Aging in Sn-Bi Solder Alloys
Author(s) Nikhilesh Chawla
On-Site Speaker (Planned) Nikhilesh Chawla
Abstract Scope Sn-Bi alloys are being developed for 3D Heterogeneously Integrated Packaging (HIP) in semiconductors because of their lower melting point compared to other Sn-based alloys. I will discuss work on Sn-70Bi alloy solidification using simultaneous 4D X-ray Microcomputed Tomography (XCT) and Energy Dispersive Diffraction (EDD) at beamline 7-BM of the Advanced Photon Source (APS). The microtomography analysis revealed the morphological changes and growth kinetics, while the EDD investigation provided the information regarding phase composition and lattice strain. In particular, we will report on the formation of Bi pyramid structures during solidification. After solidification, precipitation of Bi is driven by surface diffusion. I present results from a systematic observation of surface precipitation in Sn-7Bi solder alloy. Grain properties were first characterized with EBSD and EDS, followed with time-resolved imaging, using scanning electron microscopy. The precise nature of mechanisms associated with precipitation will be discussed.
Proceedings Inclusion? Planned:
Keywords Characterization, Electronic Materials, Phase Transformations

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