Recent Advances in Functional Materials and 2D/3D Processing for Sensors, Energy Storage, and Electronic Applications: Functional Materials and Printed Electronic Devices
Sponsored by: TMS Functional Materials Division, TMS: Thin Films and Interfaces Committee
Program Organizers: Pooran Joshi, Elbit Systems of America; Rahul Panat, Carnegie Mellon University; Ravindra Nuggehalli, New Jersey Institute of Technology; Tolga Aytug, Oak Ridge National Laboratory; Yong Lin Kong, University of Utah; Konstantinos Sierros, West Virginia University

Wednesday 2:00 PM
March 17, 2021
Room: RM 22
Location: TMS2021 Virtual

Session Chair: Pooran Joshi, Oak Ridge National Laboratory; Ravindra Nuggehalli, New Jersey Institute of Technology; Konstantinos Sierros, West Virginia University


2:00 PM  Invited
3D Printed Passive Sensors: An Overview: Vishal Mehta1; Nuggehalli Ravindra2; 1Ohio Northern University; 2New Jersey Institute of Technology
    Recent advances in 3D printed passive sensors have opened up new markets in a variety of applications. In order to function, passive sensors do not need any outside power and directly create an output response. These sensors either measure pressure or humidity or temperature or smoke or gases such as Ammonia, SO2, CO and CO2. Advanced 3D filaments/materials are enabling industry to design and manufacture reliable, accurate and cost-effective sensors rapidly to address the requirements of food & drug industry, monitoring the environment, and biomedical, renewable energy, soft robotics related applications. The talk will highlight improvements in the manufacture of these sensors and present various case studies. A summary of the market and recent patents related to the 3D printed passive sensors will be presented.

2:25 PM  Invited
Direct Metal Contacts Printing on 4H-SiC for Radiation Detection: Neil Taylor1; Yongchao Yu2; Mihee Ji2; Nora Dianne Ezell2; Pooran Joshi2; Lei Raymond Cao3; 1Oak Ridge National Laboratory; The Ohio State University; 2Oak Ridge National Laboratory; 3The Ohio State University
    SiC Schottky diodes can act as effective radiation detectors with applications in nuclear fuel cycle, medical imaging, homeland security and non-proliferatrion, to name a few. 4H-SiC diodes with printed Ag, Au, and Pt Schottky metals were fabricated and their electrical performance was characterized by forward and reverse IV measurements. Alpha radiation detection capability of these devices was demonstrated with a nomial energy resolution of 1.89% at 5.486 MeV and the best achievable resolution at 0.51%, compared to 0.29% using cleanroom fabricated SiC devices. Transmission electron microscopy (TEM) and scanning electron microscopy (SEM) images of the interface between the printed metal contacts and the SiC epitaxial layer were acquired, showing an imperfect bonding at the intersurfaces that may explain the nonideal diode behavior of the devices. When neutron sensitive layer such as boron caribide is printed on the top of metal contacts, this device can be used as a neutron detector.

2:50 PM  
Modeling of Rheological Properties of Metal Nanoparticle Conductive Inks for Printed Electronics: Patrick Dzisah1; Nuggehalli Ravindra1; 1New Jersey Institute of Technology
    The ever-growing demand for low-cost, environmentally-friendly and flexible wireless devices has set the stage for Inkjet-printing technology as the alternative to conventional fabrication techniques such as etching and milling. Conductive inks enable digital printing of electronic components and circuits in applications where extremely fine lines are required, such as OLED panels, solar cells, printed antennae and touch panels. In sensor and circuit designs, conductive traces on substrates can only be formed by using a conductive ink and hence open the door further research opportunities.This work focuses on exploring the techniques and possible material candidates for conductive ink development with the aim of improving or enhancing the conductive natures of the conductive ink. Factors influencing the surface interaction between conductive ink and flexible substrates such as paper are also discussed.

3:10 PM  
High Strength Nanotwinned Copper Foils for Current Collectors in Lithium Ion Battery: Chen Fu-Chian1; Chen Chih1; 1National Chiao Tung University
    The demand for high density energy storage devices in electronic products is increasing. The application of various wearable devices in medical treatment, health management is also gradually emerging, which also requires high-performance power storage components. Recently, we have successfully electroplated nanotwinned copper foils with a titanium wheel setup, and their ultimate tensile strength can reach to over 800 MPa, while maintain an acceptable ductility. The conductivity of nanotwinned copper foil can reach more than 90% IACS (International Annealing Copper Standard). Nanotwinned copper foil with high mechanical strength and conductivity not only enhance the weight energy density and volume energy density of the battery, it also solves the reliability issue during the charge and discharge cycles.

3:30 PM  Invited
Advancing Multiscale 3D Printing of Bioelectronics with Soft Matter Physics: Yong Lin Kong1; 1University of Utah
    The synergistic integration of nanomaterials with 3D printing can enable the creation of architecture and devices with an unprecedented level of functional integration. My research focuses on the multiscale integration of nanomaterials with physical phenomena in a 3D printing process, enabling the creation of unique functional bioelectronics that can address unmet clinical needs. As an example, I will first highlight the development of 3D printed quantum-dots light-emitting diode, which extended the reach of 3D printing and demonstrated that active electronic materials and devices can be entirely 3D printed. I will then highlight the latest development of a 3D printed gastric resident electronics system, which leverages the significant space and immune-tolerant environment available within the gastrointestinal tract to circumvent the potential complications associated with surgically placed medical implants.

3:55 PM  Invited
Nanostructured Thin Film Enabled Thermal Emission Based Passive Sensing for Extreme Environment Applications with Optical Fibers: Paul Ohodnicki1; Sheng Shen2; Henry Du3; 1University of Pittsburgh; 2Carnegie Mellon University; 3Stevens Institute of Technology
    Recent work has demonstrated the potential for extraction of near field thermal emission of functional nanomaterials and the application for passive sensing at extreme temperatures through integration with optical fibers. This presentation will overview the fundamental operation principles of thermal emission based passive sensing devices for extreme temperatures and will present examples of functional material systems that have been investigated to date including: (1) Sn-doped In2O3, (2) La-doped SrTiO3, and (3) Au-nanorod integrated anodized aluminum oxide. Computational calculations of near-field thermal emission will be presented and the results will be compared with experimentally derived results of thermal emission for both silica and sapphire based fiber sensing platforms. Preliminary sensing results for both temperature and gas phase chemistry will also be presented, as well as a discussion of future opportunities with this technology platform.