Electronic Packaging and Interconnections: Advanced Bonding and Interface
Sponsored by: TMS Functional Materials Division, TMS: Electronic Packaging and Interconnection Materials Committee
Program Organizers: Tae-Kyu Lee, Cisco Systems; Albert T. Wu, National Central University; Won Sik Hong, Korea Electronics Technology Institute; Kazuhiro Nogita, University of Queensland; Govindarajan Muralidharan, Oak Ridge National Laboratory; David Yan, San Jose State University; Luke Wentlent, Plug Power
Tuesday 10:00 AM
March 1, 2022
Room: 303B
Location: Anaheim Convention Center
Session Chair: Kazuhiro Nogita, University of Queensland; Xin-Fu Tan, University of Queensland; Govindarajan Muralidharan, Oak Ridge National Laboratory; Luke Wentlent, Plug Power
10:00 AM Invited
NOW ON-DEMAND ONLY - Tin Whisker Growth in Space: Katsuaki Suganuma1; Norio Nemoto2; Tsuyoshi Nakagawa2; Seiichiroh Kan2; Shinichiroh Ichimaru2; 1Osaka University; 2Japan Aerospace Exploration Agency
The authors reported that tin whisker growth in vacuum simulating a pace environment, severe thermal cycling in vacuum. The result showed much serious whisker growth than those used in normal air environment. The real space thin whisker growth experiment on tin plated samples, 42 alloy plates, copper pates and ceramic components, by the Kibou station of International Space Station (ISS) for three years. The first one year samples returned. One year in ISS makes about 6000 thermal cycles. The highest temperature was estimated as 65 ºC. Microstructural observation revealed that thin straight whiskers of a few hundreds µm grew on tin plated 42 alloy plates and ceramic components. In contrast, controlled thermal cycled samples on the earth showed short winding whiskers, which is a typical thermal cycling whisker. The detail whisker growth mechanism in space will be discussed.
10:25 AM
Die-bonding Performance and Mechanism of Ag Micron Paste with Pressure-less Sintering: Tetsu Takemasa1; Chuantong Chen2; Katsuaki Suganuma2; 1Senju Metal Industry Co., Ltd.; 2Osaka University
Ag particle paste sintering has been developed and shown a good performance in areas such as high-temperature reliability and high electronic conductivity. Recently, it was found that the microstructure of a sintered Ag layer exhibits a coarse-dense inhomogeneous distribution after sintering, which depends on the loading speed of a die during the chip mounting process due to the flow characteristics of the Ag particle paste. In this work, the effect of the die mounting speed and the push-in amount (push depth) in the die mounting process on the microstructure of the sintered Ag layer, shear strength and thermal cycling reliability of Ag sinter joint structures were investigated.
10:45 AM
NOW ON-DEMAND ONLY – Study of Creep Properties of Sn-Ag-Cu Alloys Employing Different Strain Rates Using Nanoindentation: M.A. Mamun1; Donald Stone2; Abdelmageed Elmustafa1; 1Old Dominion University; 2University of Wisconsin-Madison
The mechanical properties of SAC305 bulk and films fabricated using thermal evaporation from a SAC spool are reported. XRD, FE-SEM, AFM, and nanoindentation were used to investigate the SAC films crystal structure, thickness, grain structures, surface morphology, and SAC mechanical properties. XRD diffraction of the SAC films exhibited β-Sn crystallographic planes of (200), (101), and (211) orientations with a dominant β-Sn (200) at 2Θ = 30.5°. FE-SEM images indicated formation of a discontinuous film of a thickness of 70-75 nm and AFM images depicted formation of equiaxed grains of grain size between 5-100 nm. For bulk SAC material, we conclude that the hardness increases with the increase of the strain rate and the modulus was not influenced by the strain rate. Changing the hold time at peak loads or the rate of loading for the creep experiments had no measurable bearing on the creep properties of the bulk SAC material.