Printed Electronics and Additive Manufacturing: Functional Materials, Processing Techniques, and Emerging Applications: Session II
Sponsored by: TMS Functional Materials Division, TMS: Thin Films and Interfaces Committee
Program Organizers: Tolga Aytug, Oak Ridge National Laboratory; Pooran Joshi, Elbit Systems of America; Rahul Panat, Carnegie Mellon University; Yong Lin Kong, University of Utah; Konstantinos Sierros, West Virginia University; Changyong Cao, Case Western Reserve University ; Dave Estrada, Boise State University; Ravindra Nuggehalli, New Jersey Institute of Technology
Monday 2:00 PM
March 20, 2023
Room: Sapphire 411B
Location: Hilton
Session Chair: David Estrada , Boise State University; Pooran Joshi, Oak Ridge National Laboratory; Anming Hu, The University of Tennessee
2:00 PM Invited
Printed Electronics for Space-based Applications: Emily Heckman1; 1AFRL/RYDI
While printed electronics has become a more established technology in the past several years, space-based applications for printed electronics (and additive manufacturing in general) remain less mainstream. Yet, this technology can offer many advantages to space-based platforms not only in significant savings in cost, size and weight but also in new materials with enhanced properties and new design architectures. This talk will provide an overview of printed electronics for space-based applications – including the advantages, as well as challenges, in working in this domain.
2:25 PM Invited
3D-printed Sensors Optimized for Remote Monitoring of Declared Hazardous and Nuclear Containers: Stylianos Chatzidakis1; 1Purdue University
In this work, we discuss the development of low-cost 3D-printed Surface Acoustic Wave (SAW) sensors optimized for remote monitoring of declared nuclear containers. Reducing the amount of time an inspector spends verifying container inventories using remote sensing instead of conventional tagging systems would be less intrusive, reduce radiation exposure to inspectors, and would provide a more efficient and effective method for these types of inspections. In addition, to ensure economic competitiveness and minimize sensor costs it is equally important to guarantee a simple, streamlined, and cost-efficient manufacturing procedure. The SAW sensors were customized to operate with unique RFID signatures using a state-of-the-art aerosol jet printer that enables the precise fabrication of sensors with features as small as 10 μm.
2:50 PM Invited
Additive Manufacturing for Passive In-pile Sensors: Kiyo Fujimoto1; David Estrada2; Tommy Holschuh1; Lance Hone1; Nicholas Der Garabedian3; Troy Unruh1; Michael McMurtrey1; 1Idaho National Laboratory; 2Boise State University; 3Villanova University
Additive manufacturing based direct-write technologies (DWTs) have emerged as the predominant enabler for the development and fabrication of advanced nuclear sensors. Here we present the use of these methods to accelerate, modernize, and enhance the functionality of sensors to achieve the goal of improving the safety and efficiency of processes that take place within a nuclear reactor. A significant thrust of this work has been the development of nuclear relevant feedstock compatible with direct-write processes for the development, fabrication, and testing of AM sensors for peak temperature detection and neutron flux monitoring. Incorporating AM techniques provides solutions for space-limited applications while also providing an opportunity to significantly expand the design possibilities for devices. The results from these activities highlight DWTs as potential solutions for the development of miniature and robust sensors that are difficult to achieve with traditional fabrication methods for nuclear instrumentation.
3:15 PM
Printed High Temperature Irradiation Resistant Thermocouples for Real-time Monitoring of Nuclear Reactor Components: Josh Eixenberger1; David Estrada1; Katelyn Wada1; Nicholas McKibben1; Richard Fink2; 1Boise State University; 2Applied Nanotech, Inc.
Additive manufacturing (AM) of sensors that are capable of real-time monitoring nuclear reactor component’s thermal properties is crucial for furthering the advancement of existing and next generation nuclear reactors. Sensors employed to measure thermal properties in-pile must be able to withstand high temperatures and high neutron flux while maintaining long-term stability. Thermocouples fabricated using Niobium and Molybdenum have shown good resistance to this extreme environment but can be difficult to fabricate using traditional methods. AM approaches to fabricating these high temperature irradiation resistant thermocouples enables fast, high precision sensor fabrication and can be printed on conformal surfaces to monitor various structural components, minimizing intrusion and improve design flexibility. In this work, we developed Mo/Nb nanoparticle-based inks compatible with jetting printer technologies. We investigated sintering conditions, electrical properties, and report on the thermocouples performance at high temperatures. This work demonstrates the feasibility of this approach and enables extreme environment temperature detection.
3:35 PM Break
3:55 PM
Recent Progresses of Nanojoining: Fundamentals and Applications for Single-wire Devices: Anming Hu1; 1University of Tennessee
In this talk I will first review the latest progresses of nanojoining from over 20 research groups cross the world. Two kinds of mechanisms for nanojoining, thermal and non-thermal mechanisms, will be discussed. A hybrid nanomanofactruing is introduced by integrating aerogel printed microtweezer manipulation and femtosecond laser machining. With the development of hybrid manufacturing with nanomanufacturing and femtosecond laser cutting and spot welding, the blooming future of nanojoining for fabrication of single wire devices is predicted.