Materials Processing Fundamentals: Metal Processing and Manufacturing
Sponsored by: TMS Extraction and Processing Division, TMS Materials Processing and Manufacturing Division, TMS: Process Technology and Modeling Committee
Program Organizers: Jonghyun Lee, Iowa State University; Samuel Wagstaff, Oculatus Consulting; Alexandra Anderson, Gopher Resource; Fiseha Tesfaye, Metso Metals Oy, Åbo Akademi University; Guillaume Lambotte, Boston Metal; Antoine Allanore, Massachusetts Institute of Technology
Wednesday 2:00 PM
March 17, 2021
Room: RM 42
Location: TMS2021 Virtual
Session Chair: Allie Anderson, Gopher Resource; Yunbo Wang, Caterpillar Inc.
2:00 PM
Effect of Dissolution of Titanium Ions on Ti Alloys Electrodeposition from EMIC-AlCl3 Ionic Liquid at Low Temperature: Pravin Shinde1; Ramana Reddy1; 1The University Of Alabama
In this work, a cost-effective route is demonstrated to obtain Ti alloys from ionic liquid (IL) consisting of 1-ethyl-3-methylimidazolium chloride (EMIC) and a 0.667-mole fraction of aluminum chloride (AlCl3). The electroanalytical techniques such as cyclic voltammetry (CV), chronoamperometry (CA), and chronopotentiometry (CP) are used to tailor the electrosynthesis parameters. The electrodeposition of Ti alloy from EMIC-AlCl3 IL is accomplished on different cathode electrodes in a galvanostatic mode at 100°C using the Ti anode as a sacrificial donor source of Ti ions in the IL and platinum as a reference electrode. The Ti alloys deposited at different synthesis conditions are analyzed using scanning electron microscopy, energy-dispersive X-ray spectroscopy, and X-ray diffraction techniques.
2:20 PM
Cylindrical and Planar Magnetron Sputtering for Microstructural Control: Adie Alwen1; Alina Garcia Taormina1; A.M. Hodge1; 1University of Southern California
This work investigates the influence of target geometry on the resulting plasma gas glow discharge in cylindrical magnetron (hollow cathode) sputtering and its corresponding effects on thin film microstructure during deposition. The impact of elastic and inelastic collisions, magnetic field, and ion motion on plasma distribution are discussed and compared to traditional planar sputtering. Plasma properties were characterized using a Langmuir probe and film microstructure and morphology were observed via characterization techniques including SEM, TEM, and EBSD. By combining these techniques, correlations between plasma distributions and microstructural variations were explored to offer insight into the importance of target geometry on sputtered thin film growth and microstructural features.