Recent Advances in Printed Electronics and Additive Manufacturing: 2D/3D Functional Materials, Fabrication Processes, and Emerging Applications: Poster Session
Sponsored by: TMS Functional Materials Division, TMS: Thin Films and Interfaces Committee
Program Organizers: Pooran Joshi, Elbit Systems of America; Rahul Panat, Carnegie Mellon University; Yong Lin Kong, University of Utah; Tolga Aytug, Oak Ridge National Laboratory; Konstantinos Sierros, West Virginia University; Changyong Cao, Michigan State University; Dave Estrada, Boise State University; Nuggehalli Ravindra, New Jersey Institute of Technology

Monday 5:30 PM
February 28, 2022
Room: Exhibit Hall C
Location: Anaheim Convention Center


C-6: Characterization of Dispersion Strengthened Stainless Steels via Direct Ink Writing : Havva Aysal1; Konstantinos Sierros1; Brian Paul2; Chih-Hung Chang2; 1West Virginia University; 2Oregon State University
    Here an aqueous-based direct ink writing (DIW) method is introduced for stainless steel, which makes a way for eco-friendly and carbon-free ink printing. The porous structure obtained from DIW enables particle deposition easier for stainless steel. The spray deposition method makes a way for particle deposition without the use of organic solvents. The effect of deposited reinforcements on the mechanical properties of stainless steel is investigated via nanoindentation testing. The results are compared with non-dispersed stainless steels, printed via DIW.