Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XXI: On-Demand Student Poster Session
Sponsored by: TMS Functional Materials Division, TMS: Alloy Phases Committee
Program Organizers: Hiroshi Nishikawa, Osaka University; Shih-kang Lin, National Cheng Kung University; Chao-hong Wang, National Chung Chung University; Chih Ming Chen, National Chung Hsing University; Jaeho Lee, Hongik University; Zhi-Quan Liu, Shenzhen Institutes of Advanced Technology; A.S.Md Abdul Haseeb, Bangladesh University of Engineering and Technology (BUET); Vesa Vuorinen, Aalto University; Ligang Zhang, Central South University; Sehoon Yoo, KITECH; Yu-chen Liu, National Cheng Kung University; Ting-Li Yang, National Yang Ming Chiao Tung University

Monday 8:00 AM
March 14, 2022
Room: Electronic Materials
Location: On-Demand Poster Hall


Interfacial Reactions in the Sn/C194 and Sn-3.0Ag-0.5Cu/C194 Couples: Yee-Wen Yen1; Jun Wen1; You-Yan Li1; Xin-Bin Hu1; 1National Taiwan University of Science and Technology
    The solid/liquid couple technique is used to investigate the interfacial reactions in the Sn/C194 (Cu-2.3Fe-0.12Zn-0.03P, in wt.%) and Sn-3.0Ag-0.5Cu (SAC)/C194 couples at 240 to 270 C for 0.5 to 8 h. Only the (Cu,Fe)6Sn5 phase is formed at the Sn/C194 interface at 240C, and the (Cu,Fe)6Sn5 and (Cu,Fe)3Sn phases were formed at 255 and 270C. Only the (Cu,Fe)6Sn5 phase is formed in the SAC/C194 couple reacted at 240 and 255C. When the reaction temperature was increased to 270C, both (Cu,Fe)6Sn5 and (Cu,Fe)3Sn phases were observed at the interface. The intermetallic phase dispersion distance in the Sn/C194 and SAC/C194 couples was increased with the increase of reaction temperatures and times. Due to the dissolution of Fe atoms and providing the heterogeneous nucleation site in the molten solders, the micro-island shaped of the (Cu,Fe)6Sn5 phase was observed in these two couples.