Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology: Transient Liquid Phase Bonding and Nanosolder
Sponsored by: TMS Functional Materials Division, TMS: Electronic Packaging and Interconnection Materials Committee
Program Organizers: Fan-Yi Ouyang, National Tsing Hua University; C. Robert Kao, National Taiwan University; Albert T Wu, National Central University; Fay Hua, Intel Corporation; Yan Li, Intel Corporation; Babak Arfaei, Binghamton University; Kazuhiro Nogita, The University of Queensland

Thursday 8:30 AM
March 2, 2017
Room: 30E
Location: San Diego Convention Ctr

Session Chair: Fan-Yi Ouyang, National Tsing Hua University; Tae-Kyu Lee, Portland State University

8:30 AM  
Transient Liquid Phase Processing of Sn-Cu Alloys for Soldering Applications: Stuart McDonald1; Syeda Mehreen1; Flora Somidin1; Arif Mohd Salleh1; Kazuhiro Nogita1; 1Nihon Superior Centre for the Manufacture of Electronic Materials
    In tin-rich Sn-Cu alloys with a copper concentration in excess of 7.6 wt%, solidification commences with the nucleation and growth of the Cu3Sn phase. The equilibrium phase diagram predicts that on further cooling this Cu3Sn will undergo a peritectic reaction with the remaining liquid to form Cu6Sn5. This research investigates this solidification sequence using real-time synchrotron X-ray analysis including the effect of ternary nickel additions. It was found that the extent of the peritectic reaction is highly dependent on the nickel concentration and the formation of Cu3Sn can be completely suppressed after a critical concentration is exceeded . The results of this study were used as the rationale to develop a high-temperature solder alloy for use in transient liquid phase (TLP) processing. The reaction sequence of the TLP alloy during reflow soldering on a copper substrate is described.