Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology: Intermetallic Compound and Microstructural Evolution of Pb-free Materials
Sponsored by: TMS Functional Materials Division, TMS: Electronic Packaging and Interconnection Materials Committee
Program Organizers: Fan-Yi Ouyang, National Tsing Hua University; C. Robert Kao, National Taiwan University; Albert T Wu, National Central University; Fay Hua, Intel Corporation; Yan Li, Intel Corporation; Babak Arfaei, Binghamton University; Kazuhiro Nogita, The University of Queensland

Wednesday 8:30 AM
March 1, 2017
Room: 30E
Location: San Diego Convention Ctr

Session Chair: Kazuhiro Nogita, The University of Queensland; Sergey A Belyakov, Imperial College London