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Meeting 2019 TMS Annual Meeting & Exhibition
Symposium Fracture Processes of Thin Films and Nanomaterials
Sponsorship TMS Materials Processing and Manufacturing Division
TMS: Nanomechanical Materials Behavior Committee
Organizer(s) Daniel Kiener, University of Leoben
Megan J. Cordill, Erich Schmid Institute of Materials Science
Johannes Ast, Empa, Swiss Federal Laboratories for Materials Science and Technology
Brad L. Boyce, Sandia National Laboratories
Scope This symposium will focus on recent developments in the field of fracture of thin films and small volumes, focusing on the uncovering the mechanisms responsible for improved properties. Such novel insights are enabled by advanced testing technologies paired with comprehensive characterization at the nanoscale and a suited fracture-mechanical analysis. With the wide variety of applications (semiconductors, printed electronics, energy storage, protective coatings, etc.) and the required control of structural and functional properties, a better understanding of the relationship between processing, microstructures, and failure mechanisms is required to design more robust and reliable devices and structures for use in any environment. The deformation characteristics of thin films and small volumes have been explored for years using different in-situ and ex-situ techniques (nanoindentation, TEM, SEM, micro-XRD, etc). However, the need for examination of local fracture processes calls for dedicated testing techniques that permit high temporal and local resolution of structural and mechanical properties, ideally coupled with measurements of electrical or thermal characteristics under applied load. Furthermore, the enhanced understanding of the impact of interface design on fracture in thin films and nanostructured materials is of interest. The combination of advanced testing techniques with adapted fracture mechanics evaluation concepts will enable a safe design of future components based on thin films and small volumes.

The subject areas of the symposium include, but are not limited to:
• Local analysis of stress and strain around crack tips
• Fracture of nanostructured materials (thin films, printed structures, nanocrystalline materials, …)
• Developments in nanoporous materials for energy harvesting or storage applications
• Fracture concepts to analyze miniaturized volumes and bridge scales to macroscopic properties
• New developments in fracture testing techniques using coupled in-situ measurements (electrical, optical, mechanical, etc.) or in enhanced environments (high temperatures, humidity controlled, etc.)

A joined session on fracture in harsh environments (symposium ‘Micro- and nanomechanical testing in harsh environments’) is planned.

Abstracts Due 07/16/2018
Proceedings Plan Planned: Supplemental Proceedings volume

Alloying Effects on Ductility of Nanostructured Cu-X (X = Zr and W) Thin Films
Analysis of Fracture Surface Morphology in Microscale GaAs and Ge Films
Can We Measure the Crack Length during in Elastic Plastic Fracture Reliably at the Micron Scale? A Case Study in Nanocrystalline Tungsten
Constituent Constraining Effects on the Microstructural Evolution and Fracture Behaviors of Crystalline/amorphous Nanolaminates
Dependence of the Fracture Toughness of Freestanding Metallic Thin Films on their Yield Strength and Microstructure
Designing New Hard Coating Material Systems Utilizing AB Initio DFT Calculations
Enhanced Fracture Toughness of Mg/Nb Laminated Composites
Experimental Characterization of Commercial Thermal Barrier Coating Systems
From Quantum to Continuum Mechanics: Studying the Fracture Toughness of Transition Metal Nitrides and Oxynitrides
Impact of Alloying and Interfaces on Fracture Toughness of Transition Metal Nitrides and Borides
Impact of Internal Defects on the Deformation of Nanocrystalline Materials
Improving Mechanical Properties of Mixed Transition Metal Carbide Reinforcements in Steel
In Situ Fracture of Reliability Relevant Interfaces in Microelectronic Devices
In Situ Stable Fracture of Ceramic Interfaces Tested under Environmental Conditions
In Situ TEM Fracture Experiments at RT
In Situ TEM on Crack Growth and Dislocation Shielding in Metallic Thin Foils
In Situ Transmission Electron Microscopy Observation on Fracture Process of High Entropy Alloys
Interactions between Surface Topography, Multilayers, Nano-microstructure, Friction and Defects with Respect to Fracture Behavior and Safe Design of Diamond-like Carbon Thin Films
Interface Control of Fracture in Multilayer Films
Interfacial Fracture Toughness of GaN Film on Diamond Substrate for Application in Ultra-high Power Radio Frequency Devices
Investigating Plasticity Effects on Fracture at the Microscale: The Ductile to Brittle Transition (DBT)
Mechanical Deformation of AlN-Ag Nano Multilayers
Multi-scale Study of the Deformation Mechanisms of p-type Half-Heusler Hf0.44Zr0.44Ti0.12CoSb0.8Sn0.2 Nanostructured Thermoelectric Alloy
N-22: Cohesive and Adhesive Failure of Cu-Zr Amorphous Films on Polyimide Substrates: Effects of Deformation-induced Devitrification
N-23: Dislocation-induced Ratcheting Failure in Single Crystalline Face Centered Cubic Thin Films
N-24: Factors Controlling Thin Film Adhesion of Nanocrystalline NiW Alloys
N-25: Planarity of Deformation and Representative Volume Elements of Heterogenous Network Thin Films
N-26: Tearing and Damage Evolution in Al Thin Films
N-27: Zones of Active Plasticity: The Three Damage Zones in Ductile Tearing of Metallic Thin Films
Nanoindentation of Silicate Glasses at Loads Near the Cracking Threshold
Relationships between Deformation Fields and Fracture in Heterogeneous Network Thin Films
Reliable Lead-free Solders for Harsh Environments: Microstructure and Fracture Behaviour
Size Dependent Fracture Behaviors of Metallic Glass Nanolaminates
The Meso-scale Fracture Behavior of Single Crystalline Tungsten Based on Femtosecond Laser Processed Samples
Understanding Brittle-to-ductile Transition Using Micro-fracture Tests and HR-EBSD
Understanding Interface Failure and Fracture in Silicon Carbide Composites
Unravelling the Role of Interfaces on the Shock Response of Nanocrystalline Cu/Ta Alloys
Using the Steady-state Work Density Gradient Crack Tip Parameter to Characterize Steady State Crack Growth in Metal Thin Films

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