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About this Symposium
Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVII
Sponsorship TMS Functional Materials Division
TMS: Alloy Phases Committee
Organizer(s) Shih-kang Lin, National Cheng Kung University
Chao-hong Wang, National Chung Cheng University
Jae-Ho Lee, Hongik University
Chih-Ming Chen, National Chung Hsing University
Thomas L Reichmann, Karlsruhe Institute of Technology
Yu Zhong, Worcester Polytechnic Institute
Hiroshi Nishikawa, Osaka University
Shien Ping Feng, The University of Hong Kong
Yee-Wen Yen, National Taiwan University of Science & Technology
Song-Mao Liang, Clausthal University of Technology
Scope This is the 17th in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. Topics of interests range from microelectronic technologies to advanced energy technologies, including phase stability, transformation, formation, and morphological evolution of electronic packaging materials, interconnection materials, integrated circuit materials, optoelectronic materials as well as energy storage and generating materials.
Abstracts Due 07/16/2017
Proceedings Plan Planned: Supplemental Proceedings volume
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

A Phase-field Model on Electromigration-induced Transgranular Void Migration in Interconnects
Alloy Phase Stability under Electric Currents
Dissolution Kinetic of Ni Wire in Sn and Sn3.5Ag Solder
Effect of Ag Additives on Dissolution Kinetic of Cu Wire in Sn and Sn3.5Ag Solder
Effects of Electrochemical Parameters on the Physical Properties of Ni-Co Electroplating
Electric Current-induced Slip/Twin Transition: An In Situ EBSD Study
Electrochemical Etching of Solder Resist to Improve Adhesion of Electroless Copper Plating in PCB
Fabrication and Characterization of (111)-oriented and Nanotwinned Cu by Periodic Reverse Electrodeposition
Ga-doping Effect upon Sn-0.7Cu/Cu Interfacial Reactions and the Isothermal Section of Sn-Cu-Ga Ternary System
High-entropy Oxides Li(Ni0.2Mn0.2Co0.2Zn0.2Cu0.2)O2 as Cathode Materials for Lithium-ion Batteries
Inter-diffusion at Ag/Cu Interface
Interfacial Reaction Studies in SLID Bonding Processes Using Ga and In
Hide details for [<a href="/PM/PM.nsf/ApprovedAbstracts/7B7A9BA8C19DD3BE85258150001FB51F?OpenDocument">Interfacial Reactions beInterfacial Reactions between Lead-free Solders and Cu-xZn Alloys
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Interfacial Reactions in the Au/Sn/Ni/Cu Multilayer Couples
Liquidus Projection of Quaternary Ge-Sn-Co-Sb System and Thermoelectric Properties of Sn/Ge Doped Skutterudite CoSb3
Mechanical Properties of In-33.7Bi Alloy for Low Melting Temperature Solder
Microstructure and Optical Properties of Cr1-xAlxN Films Synthesized by Reactive Magnetron Sputtering
Microstructure Evolution due to Isothermal Reactive Diffusion between Solid Co and Liquid Sn
Microstructure Evolution of Al Wire Bonded on Cu Metallization under Electromigration Test
Minor P-doping in the Electroplated Co(P) Layer to Strongly Suppress IMC Formation in Lead-free Solder Joints
Nanoparticles and Nanowires Based on Ag and Cu in Printed Electronics and Transparent Electrode
On the Existence of a Two-phase Field in Binary α-Cu(Al) Solid Solutions
Phase Equilibria of the Li-Si-C System for Advanced Anodes in Li-ion Batteries
Predication of the Intrinsic Properties of Multi-component Electrodes for Li-ion Batteries from Aspect of Thermodynamics
Solid-solution Cu-to-Cu Interconnection Fabricated with Sub-micron Ga-based Pastes
Structural Stability and Chemical Reactivity of Nanoscale Twinning Structure in Copper Nanowires
The Electromigration Effect Revisited: An In Situ SEM and SR-based XRD Study
The Investigation of Electromigration Defects on Cu/Sn and Cu/Ag IMC due to Currents Stress and Temperature
The Role of Retained Structures in Phase Transition and Piezoelectric Properties of PMN-PT Single Crystals
The Study of Interfacial Reactions between Sn and C194 Alloy
Thermodynamic Stability Maps for the La0.6Sr0.4Co0.2Fe0.8O3▒δ–SO2–O2áSystem for Application in Solid Oxide Fuel Cells


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