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About this Symposium
Meeting Materials Science & Technology 2016
Symposium Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
Sponsorship
Organizer(s) Albert T. Wu, National Central University
Iver Anderson, Ames Laboratory
Scope New materials and technologies are required for the advances in microelectronic, optoelectronic and nanoelectronic devices to meet the increasing thermal, mechanical, reliability, electrical performance and environmental demands placed on interconnects and packaging at all levels. This symposium will address current researches in processing and properties of new and existing materials for emerging interconnects and Pb-free materials for advanced packaging technologies.

Topics of interest include, but are not limited to:
 Emerging interconnect materials and technologies, e.g., 3D stacking including through-silicon-vias (TSVs), optoelectronic interconnects and flexible electronics
 High temperature Pb-free solders and associated interconnects for automotive and power electronics
 Low temperature Pb-free solders for advanced packaging technologies
 Continuing challenges in implementing Pb-free solders for interconnect, plating and TIM applications
 Non-solder interconnect materials at chip and package levels
 Electromigration, thermomigration, stress-migration and mechanical effects
 Whisker growth in tin, tin-based alloys and other metallic systems
 Advanced characterization methods as applied to interconnect technology
 Fundamental materials behavior including phase transformations, computational thermodynamics, solidification, microstructure evolution, corrosion, mechanical, thermal, and electrical properties of solders and IMCs
Abstracts Due 03/31/2016
Proceedings Plan Definite: MS&T all conference proceedings CD
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

A Study on Thermal Shock Property of Cu-filled through Silicon Via
Binder Chemistry Control of Electrically Conductive Adhesives for Inducing Low Temperature Sintering Ag Micro-fillers
Computational Study of Low Volume Solder Interconnects for 3D Integrated Circuit Packaging
Coupled Charge Conduction and Mass Diffusion in Solder Interconnects
Development of Metal-coated Carbon Nanotubes Reinforced Tin Composite by Ultra-sonication Assisted Melting Process and Characterization
Direct Bonding of AlN-to-metal Utilizing Sintering of Ag Nanoparticles Derived from Ag2O Microparticles
Early Stages of Formation and Growth of the Cu6Sn5 Compound during Soldering Reactions between Liquid Sn-based Alloys and a Cu Substrate
Effect of Indium Addition on Mitigating Whiskers in Electroplated Tin: Role of Oxide Layer
Effects of Sn Grain Orientation on the Microstructural Evolution of Cu Reinforced Sn-3.5Ag Composite Solder Joint under Current Stressing
Evaluation of the Joint Property for N-type Bi2Te3 Thermoelectric Module
Fabrication of Cu@Sn Core-Shell Structure Preform and Application in High Temperature Bonding
Heat-Free Soldering Using Undercooled Metals
Interactions between Electromigration and Thermal Fatigue of Pb-free Interconnects
Investigation on Subgrain Rotation Behavior in Lead-free Solder Joints during Thermal Fatigue Using EBSD In-situ Observation Technique
Joint Properties of Diffusion Barrier for Medium-temperatureThermoelectric Materials
Liquid Solid Diffusion (LSD) Bonding: Joint Structure and Bonding Method
On the Growth Kinetics of Cu6Sn5 Phase during Reaction between a Supercooled Sn-Cu Solder Alloy and Cu Substrate: Role of the Physic State of the Solder
Retardation of Intermetallic Compounds Growth Rate via Zn Doping in Under-bump Metallization in Low Reflow Temperature Bi-33In/Cu-xZn Micro-bump
Role of Ultrathin-Ni(P) Layer in ENEPIG Metallization in Ultrathin-ENEPIG/SAC305/OSP Cu Solder Joints under Thermocycling Stress
Study of the Solid-state Diffusion of Bismuth in Tin Using Electron Probe Microanalysis (EPMA)
Subgrain Rotation of Single-crystal Solder Joints at Symmetrical Locations of a BGA Component under Thermal Shock
The Variation of Grain Structure and the Enhancement of Shear Strength in SAC305-0.1Ni/Cu Solder Joint before and after Aging
Thermodynamic and Kinetic Constraints in Pb-Free Interconnect Design
Updated Research on a High Temperature Sn/Cu-Ni Composite Solder Paste
β-Sn Grain Formation in Aluminum-modified Lead-free Solder Alloys


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