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Meeting 2014 TMS Annual Meeting & Exhibition
Symposium Advanced Materials for Power Electronics, Power Conditioning, and Power Conversion II
Sponsorship TMS Electronic, Magnetic, and Photonic Materials Division
TMS: Energy Conversion and Storage Committee
TMS: Magnetic Materials Committee
Organizer(s) Paul Ohodnicki, National Energy Technology Laboratory
Michael Edward McHenry, Carnegie Mellon University
Matthew A. Willard, Case Western Reserve University
Rachael Myers-Ward, NRL
Mike Lanagan, Penn State University
Clive A. Randall, Penn State University
Scope Independent of the means by which electrical power is generated (conventional fossil, advanced fossil, nuclear, solar, wind, etc.), power conditioning and conversion is required to transform power into an appropriate form for efficient and cost-effective integration into the grid. By 2030, it is also projected that 80% of all electricity will flow through power electronics. Advanced materials including soft magnetic materials, semiconductors, and dielectric materials for capacitors are crucial for enabling the next generation of advanced power electronics technologies. These technical communities have historically worked independent of one another and materials development efforts have often been carried out in the absence of frequent and meaningful interactions with the power electronics community.

The proposed symposium aims to bridge these historical gaps through a number of technical symposia devoted to relevant materials systems including soft magnets, dielectric materials for capacitors, and semiconductor materials. The primary focus of the proposed symposium will be in the area of advanced materials for power electronics and power conditioning systems. A range of invited and contributed talks will be presented by the top materials scientists in each field. To supplement the traditional technical sessions, a selected group of technical experts from the power electronics community will also be invited to present and to engage the materials community. These invited talks are intended to promote interactions between the materials and power electronics communities, to educate the materials community about critical materials needs, and to educate the power electronics community about state-of-the-art material developments.
Abstracts Due 07/15/2013
Proceedings Plan Planned: Journal of Electronic Materials
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

A New Insight into Nanocrysallization of Amorphous Fe-based Alloys
Barium Oxide Based Glasses for Dielectric Material
Capacitor Development for Reliable High Temperature Operation in Inverter Applications
CeraLink™: A New Capacitor Technology for Power Electronics Based on Anti-ferroelectric Ceramics and Copper Electrodes
Characterization of Degradation for MLCC under Thermal and Electrical Load Using DLTS Method
Dielectric Breakdown: Theory, Characterization and Its Relationship to Energy and Power Density
Dielectrics for Advanced Power Electronics
GE SiC Power Device Development for High Performance Power Conversion Applications
Growth of Thick, On-axis SiC Epitaxial Layers by High Temperature Halide CVD for High Voltage Power Devices
High-dielectric Constant, High-Temperature Ceramic Capacitors for Power Inverters
High Performance Wide Bandgap Power Electronics
High Temperature Capacitor Films
Interface Fermi Level Unpinning in Ni/4H-SiC Schottky Diodes Fabricated on Epilayers Grown by Tetrafluorosilane-based Chemical Vapor Deposition
Investigation of Low Oxygen Partial Pressure Processing of Alkali Niobate Perovskite
Materials Issues for GaN-based HEMTs for Power Electronics
Nanocrystalline Magnetic Components for Megawatt Scale High Frequency Power Electronics
Plasma Enhanced ALD of High-k Dielectrics on GaN and AlGaN
Point Defect Control in Power III-Nitride Semiconductors
Progress in 4H SiC Wafers and Epitaxy for Power Electronics Applications
Reliability of GaN HEMTs: Electrical and Radiation-induced Failure Mechanisms
Self Healing Thin Film Electrodes for Increased Electrical Component Reliability
SiC Power Devices and Applications
Silicon Carbide in Power Electronics: Overcoming the Obstacle of Bipolar Degradation
Strongly Dipolar Polythiourea, Polyurea Dielectrics with High Electrical Breakdown, Low Loss, and High Electrical Energy Density
The Status of Commercially Viable GaN Based Power Devices
Thermal Management Challenges in GaN Electronics: Characterization and Optimized Heat Extraction


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