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About this Symposium
Meeting 2019 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVIII
Sponsorship TMS: Alloy Phases Committee
Organizer(s) Hiroshi Nishikawa, Osaka University
Shih-Kang Lin, National Cheng Kung University
Chaohong Wang, National Chung Cheng University
Chih-Ming Chen, National Chung Hsing Univ
Dajian Li, Karlsruhe Institute of Technology
Song-Mao Liang, Clausthal University Of Technology
Ming-Tzer Lin, National Chung Hsing University
Zhi-Quan Liu, Institute of Metal Research, Chinese Academy of Sciences
Jaeho Lee, Hongik University
Yee-wen Yen, National Taiwan Univ of Science & Tech
Yuan Yuan, Chongqing University
Yu Zhong, Worcester Polytechnic Institute
Scope This is the 18th in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. Topics of interests range from microelectronic technologies to advanced energy technologies, including phase stability, transformation, formation, and morphological evolution of electronic packaging materials, interconnection materials, integrated circuit materials, optoelectronic materials as well as energy storage and generating materials.
Abstracts Due 07/16/2018
Proceedings Plan Planned: Supplemental Proceedings volume
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

A model to describe kinetics of intermetallic compound with narrow homogeneity range: Cu-Sn system as an example
A Study of Nickel Metallization on Polyimide films of Different Structures by All-Wet Process
Abnormal Growth of Intermetallic Compounds in Sn/Cu Diffusion Pair
Advanced Electroplating Technologies for 2.5D and 3D Chip Packaging Fabrication
Development of Sn-Bi-In-Ga quaternary low-temperature solder
Effect of bilayers arrangement on self-propagating reactions and mechanical properties of thermite reactive nanolaminate films.
Effect of Ga-based liquid metal alloy interconnects for stretchable electronics on the durability of device contacts
Effect of inorganic additives on sintered Cu conductive thick film
Effect of Tungsten Doping on the Structure and Electronic Properties of Gallium Oxide
Exploring effective charge in electromigration effect using machine learning
Formation and growth of intermetallic compound layer at Sn-Ag-Cu-Ni solder/Cu interface using laser process
Growth behavior of compounds during reactive diffusion between solid Co and liquid Sn-base solders
Growth of Nb3Sn and Cu3Al intermetallic Phases by Reactive Diffusion Process
Improvement in thermomechanical reliability of low cost Sn-based BGA interconnects by Cr addition
Interfacial microstructure variation of ENIG/SAC305 solder joint with Ni-P electroless plating bath
Interfacial Reactions between Lead-Free Solders and the Ni-xPd-yCo Alloys
Interfacial reactions in the Ga-doped Sn-0.7Cu/Cu couples and isothermal sections of the Sn-Cu-Ga ternary system
Investigation into phase transformation of (La,Sr)y(Cr1-x,Fex)O3/ YSZ for dual-phase oxygen transport membranes
Low-Temperature Bonding Using Silver Nanoparticles Paste for Electronics Packaging
Microstructure Evolution and Physics Properties of Low Silver Copper Alloy Wires during In-situ Composite Preparation
Phase determination of low-melting In-Bi alloys on Cu substrates
Phase diagrams of the Bi-In-Se-Te quaternary system
Reactive Dissolution of Metallic Nanoparticles during Reflow and Its Effects on Microstructure and Properties of Lead Free Solder Joints
Reflowing Time Effect on Interfacial reactions and mechanical properties between Sn-9wt%Zn, Sn-3.0wt%Ag-0.5wt%Cu alloy solder and Ag substrate
Silanization engineering for silicon metallization
Size Dependence of Nucleation Controlled Hysteresis in Free-Standing VO2 Rods
Solder joint design elements: Impact of Ni in Cu-alloys on intermetallic compound formation and properties
Solid-state interfacial reactions of Sn solder joints with Bi2Te3–based thermoelectric materials
Study of metastable phase formation for sputtered thin films
Study on the phase diagrams of Bi-Te binary and Bi-Te-RE (Yb, La, Ce, Nd, Sm, Tb, Er) ternary systems
The design of magnesium-rare earth alloys based on thermodynamic calculations
The Effects of Electrochemical Parameters on the Physical Properties of Ni-Alloy Electroplating for the High Wear Resistant Materials
The improvement of solderability for diamond/Al composite by electroless plating of Ni-P coating film
The Investigation of the Interaction Between Co, Cu and Sn3.5Ag under Thermomigration
The study on currents stress effects of electromigration on IMC formation
Thermodynamic investigation into the chemical stability of LSCrF-ScSZ
Thermodynamic Stability of LiMn2-xMxO4 Spinels with multivalent Transition-Metal-Substitutions
Understanding Cation Diffusion Pathways and Roadblocks in Polymorphs of V2O5


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