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About this Symposium
Meeting 2020 TMS Annual Meeting & Exhibition
Symposium 16th TMS Workshop on Advanced Microelectronic Packaging, Interconnection Technology, and Pb-free Solder
Sponsorship
Organizer(s) Eric J. Cotts, Binghamton Univ
David Yan , San Jose State University
Mike Wolverton, Raytheon Space and Airborne Systems
Iver Anderson, Ames Laboratory
HongWen Zhang, Indium Corporation
Bhaskar Majumdar, New Mexico Tech
Nilesh Badwe, Intel Corporation
Albert Wu, National Central University
Scope Continued advances in technology are required to package thinner devices which operate at higher bandwidths and lower powers. Warpage, thermal management, thermal expansion mismatches, three dimensional structure and efficiency challenges must be addressed. As the state of the art becomes smaller and includes new embedded packaging technologies, plastic and hybrid electronics, and additive manufacturing/3D printing, new roadblocks arise. This workshop will address new demands on interconnects and packaging at all levels, including alternative interconnects, conductive adhesive, Pb free solder, epoxy, substrates, 3D packaging, wafer level packing, quality, reliability, and failure analysis.
Abstracts Due
Proceedings Plan Undecided
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE
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