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About this Symposium
Meeting 2015 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIV
Sponsorship TMS Functional Materials Division (formerly EMPMD)
TMS: Alloy Phases Committee
Organizer(s) Chao-hong Wang, National Chung Cheng University
Jae-Ho Lee, Hongik University
Clemens Schmetterer, Forschungszentrum Juelich, Inst. For Energy and Climate Research - 2
Ikuo Ohnuma, Tohoku University
Shien Ping Feng, The University of Hong Kong
Shih-Kang Lin, National Cheng Kung University
Chih-Ming Chen, National Chung Hsing University
Yee-Wen Yen, National Taiwan University of Science and Technology
Scope This is the 14th in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. Topics of interests include phase stability issues surrounding microelectronics packaging technology or energy materials, phase formation and integrated circuit technology, and the phase stability and morphological evolution of novel electronic materials.
Abstracts Due 07/15/2014
Proceedings Plan Planned: None Selected
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

A Comparison of Solid State Reaction, Electrical Performance and Failure Mechanism of Ruthenium Schottky Contacts on 6H-SiC and 4H-SiC after Air Annealing
A Novel Ga-Based Cu-to-Cu Bonding Approach for 3D IC Packaging.
Co-relation between the Surface Microstructure of Surface-Deformed Cu Foils and the Soldering Wettability
Cu-Ag Core-Shell Nanoparticles as Conductive Ink Material for Printed Electronics Application
Effect of Different Intermetallic Compounds and Bump Heights on Thermal Cycling Tests of Microbumps
Effect of P Content on the Interfacial Reaction and Mechanical Properties of the Sn/Ni-xP Solder Joints
Effects of Additives on Electroplating of Copper in High Aspect Ratio Via Filling
Effects of Complexing Reagent on Electroless Nickel Iron Alloy Plating for the Diffusion Barrier of UBM
Interfacial Reaction in Cu/Pb-Free Solders/Co Couples during Reflowing and Solid-State Aging Process
Interfacial Reaction of the Ni/Sn-xZn/Cu Sandwich Couples
Interfacial Reaction of Zn-Al Based High Temperature Solders
Interfacial Reactions between Sn and Electroless Co(P) Metallization
Interfacial Reactions in Sn-0.7Cu-xGa/Cu Joints and Phase Equilibria of the Cu-Ga-Sn Ternary System at 200 °C
Interfacial Reactions of the Au/Sn-xZn/Cu Sandwich Structure Couples
Investigation of Pt-Based Sensor Failure Induced by Phosphorous Gases
Nb-Doped TiO2 Mesoporous Film and Its Application in DSSCs
Phase Diagrams of Pb-Sb-Se Ternary System
Phase Equilibria of Cu-In-Se Ternary System
Phase Stability of Sn-Pb, Sn-Cu and Sn-Ag Binary Systems under Current Stressing
Role of Interfacial Structure on the Intrinsic Growth Stresses in Metallic Thin Film Multilayers
Solid-State Reactive Diffusion between Binary Sn-Base Alloys and Conductor Metals
Study of Cu-Pd Interdiffusion Bonding
Study of Low Melting Sn-Bi-xGa Solder Alloy
Synthesis and Characterization of Electroless Silver Plating on Multiwall Carbon Nanotube
The Effect of Mass Spalling on Joint Strength of SAC Solder/Co-Based Surface Finishes.
The Effect of Template Geometry on the Eutectic Growth of Directionally Solidified Binary Organic Metamaterials: A Phase-Field Study
Thermodynamic Investigation of the Perovskite Electrical Conductivity
Ab Initio Physical and Electrochemical Properties of Kröhnkite-Type Na2Fe(SO4)2∙2H2O Sulfate as Cathode for Na Ion Batteries


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