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Meeting 2019 TMS Annual Meeting & Exhibition
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Sponsorship TMS: Electronic Packaging and Interconnection Materials Committee
Organizer(s) Kazuhiro Nogita, University of Queensland
Tae-Kyu Lee, Portland State University
Yan Li, Intel Corporation
Christopher M. Gourlay, Imperial College London
Zhi-Quan Liu, Chinese Academy of Sciences
Rahul Panat, Carnegie Mellon University
Albert T. Wu, National Central University
Andre M. Delhaise, Celestica
Mohd Arif Salleh, Universiti Malaysia Perlis
Scope Continuing advances in microelectronic, optoelectronic and nanoelectronic devices require new materials and technologies to meet the increasing electrical, thermal, mechanical, reliability, performance and environmental demands placed on interconnects and packaging at all levels. This symposium will address current researches in Packaging Materials and Process, including Pb free solder, alternative interconnects, conductive adhesive, epoxy, substrates, 3D packaging, wafer level packaging, quality, reliability, and failure analysis.
Abstracts Due 07/16/2018
Proceedings Plan Planned: Supplemental Proceedings volume

A Novel Joining Process for the Die-attachment of Next-generation Power Devices
A Preliminary Study of Oxide Film Break-down during Ultrasonic Wire Bonding
A Study on Electrical Conductivity of Micro Friction Stir Welded Dissimilar Sheets for Hybrid Electric Vehicles (HEVs)
Boron Nitride Nanotube-based Composites for Thermal Management
Chip-to-chip Cu Direct Bonding in N2 Ambient with (111)-Oriented Nanotwinned Cu Microbumps
Compression and Tension Stress Effect on Wafer Level Chip Scale Package Thermal Cycling Performance
Developing Seed Layer for Electroplating of Vertically Aligned Carbon Nano Tubes
Direct Bonding of Nanotwinned Ag Thin Films at Low Temperature
Effect of Ag on Mechanical Properties of Sn-Ag-Cu Micro-BGA Joints
Effect of Reflow Profile on Microstructure and Mechanical Properties of Low Melting Alloy (SAC/SnBi)
Effect of Sn Nanoparticles on SAC Solder Paste Preparation and IMC Growth on Cu Substrate
Effect of Strengthening Mechanism, Ageing and Shear Rate on Peak Force and Absorbed Energy of Tin-based Solder Balls Reflowed to a Copper Substrate
Effect of Thermomigration-electromigration Coupling on Mass Transport in Cu Thin Films
Effects of CuZnAl Memory Particles on the Microstructures and Property of Cu/Sn/Cu Solder Joints
Effects of Sb Additions on the Mechanical Behavior of SAC-Bi Solder Alloys
Electrodepositon of Large-scale Nanotwinned Copper Pillar within through Silicon via
Electromigration and Thermally-induced Damage in Single and Bicrystal Sn Solder Joints Analyzed by Electron Backscatter Diffraction and X-ray Tomography
High Thermally Conducting Polymer-based Films with Magnetic Field-assisted Aligned Hexagonal Boron Nitride for Flexible Electronic Encapsulation
Impression Creep of Sn-0.7Cu, Sn-3.8Ag, and Sn-3.8Ag-0.7Cu Lead-Free Solders
Influence of Low Ga and P Additions on the Microstructure and Mechanical Properties of Sn-0.7Cu
Interfacial Reaction between Copper-tin Couple under High Pressure Environment
Kinetic Monte Carlo Model for Improved Electroplating of TSVs in 3DIC
L-1: A Study on TLP Bonding using Metal-deposited Preforms for Power Modules of Automobile
L-2: Interfacial Phenomena Between Liquid Ga-based Alloys and Ni Substrate
L-3: Microstructure Formation in Sn-Cu Based Lead-free Solder Paste Transient Liquid Phase Sintering during Soldering on Different Substrate
L-4: Multi-phase-field Simulation of Electromigration in Polycrystalline Interconnect Line
L-5: PCB Surface Finish in Press-fit Interconnections
Length Scale of the Cellular Microstructure Tailoring Tensile Properties of Zn-20wt.%Sn-2wt.%Cu Solder Alloy
Low-temperature and Pressureless Cu-to-Cu Bonding By Microfluidic Electroless Interconnection Process
Low Resistance Cu-to-Cu Joints using Highly <111>-Oriented Nanotwinned Copper
Low Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Highly <111>-orientated Nanotwinned Cu Films
Low Temperature Cu-to-Cu Direct Bonding with Thin Gold Capping on Highly <111>-Orientated Nanotwinned Cu Films
Mechanical Assessment of Hexagonal-Cu6Sn5 Intermetallics and Multilayered Structures in Cu/Sn Joints Using Micro-Compression
Mechanical Reliability of Photovoltaic Cells under Cyclic Thermal Loading
Mechanism of Electromigration Failure in Micro Solder Joint
Micro-structure and Properties of Cu-0.3wt.%Ag Alloy Ultra-fine Wires
Microelasticity Modeling of Defects and Their Role in the Performance of Tin Ssolder Interconnects
Microstructural Evolution of High (111)-Oriented Nanotwinned Copper during Annealing and Low Temperature Cu-Cu Direct Bonding Process
Multi-phase-field Modeling for Next-generation Interconnect Devices Based on TSVs
Nucleation and Cyclic Twinning of Tin Droplets on Single Crystal Intermetallic Compounds
Orientation Relationships Between Cu6Sn5 and Ni3Sn4 in Electronic Solder Joints
Phase Transformation Induced Cracking in Solder Joints Containing Cu6Sn5
Pressure and Pressureless Silver Sintering of SiC MOSFET Power Module with Si3N4 Direct Bonded Copper
Refined Manufacturing Acceleration Process (ReMAP) M3: Thermal Preconditioning and Restoration of Bismuth-Containing Lead-Free Solder Alloys
Role of Bi, Sb and In in Microstructure Formation and Properties of Sn-Cu-Ni and Sn-Ag-Cu BGA Solder Joints
Role of Surface Chemistry of Solder Particles in Performance of Solder Pastes
Soldering of Core-shell Multi-Segment Nanowires for Nanoscale Interconnection
Stress Measurement for Highly <111>-Oriented Nanotwinned Cu by Synchrotron X-ray
Study of the Solid-state Diffusion of Bi in Sn – The Effects of Temperature, High Diffusivity Pathways, and Bi Concentration
Study of Thiourea-sulfur Compound Co-deposited in Ni(P) and its Effect on Ni(P) Surface Corrosion
Study the Microstructure Evolution of Cu/In and Cu/In/Ni for Fine Pitch Interconnects
The Evolution of IMCs in Sn-based Solder Joints with Au/Ni/Cu Pads under Current Stressing
The Interaction of Ga-based Alloys and Cu Substrates at Low Temperatures
The Microstructure Evolution and Oxidation Characteristics of Sn58Bi Solder Joints under the Oxidizing Environment
The Thermomechanical Reliability at High Temperatures of Pb Free Solders
The Variation of Grain Structure and the Enhancement of Shear Strength in SAC305-0.1Ni/Cu and SAC1205-0.1Ni/Cu Solder Joint Before and After Aging
Transient Response of Composite PCMs to Periodic Heat Pulses
Twinning and Refinement of Cu6Sn5 in Ni-containing Solders
Understanding Driving Forces and Mechanisms of Tin Whisker Formation Using Multi-physics Simulations in a Crystal Plasticity Framework

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