ProgramMaster Logo
Conference Tools for 2016 TMS Annual Meeting & Exhibition
Register as a New User
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools
About this Symposium
Meeting 2016 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV
Sponsorship TMS Functional Materials Division (formerly EMPMD)
TMS Structural Materials Division
TMS: Alloy Phases Committee
Organizer(s) Shih-kang Lin, National Cheng Kung University
Chao-hong Wang, National Chung Cheng University
Jae-Ho Lee, Hongik University
Ikuo Ohnuma, National Institute for Materials Science (NIMS)
Chih-Ming Chen, National Chung Hsing University
Yee-Wen Yen, National Taiwan University of Science & Technology
Shien Ping Feng, The University of Hong Kong
Clemens Schmetterer, Fraunhofer Institute
Scope This is the 15th in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. Topics of interests range from microelectronic technologies to advanced energy technologies, including phase stability, transformation, formation, and morphological evolution of electronic packaging materials, interconnection materials, integrated circuit materials as well as energy storage and generating materials.
Abstracts Due 07/15/2015
Proceedings Plan Planned: A print-only volume

A New Insight on the Electromigration Effect: Strain-induced Atomic Migration under Current Stressing
A Significant Improvement in the Electrocatalytic Stability of N-doped Graphene Nanosheets used as a Counter Electrode for Iodide/triiodide based Dye-sensitized solar cells and [Co(bpy)3]3+/2+ based Porphyrin-sensitized Solar Cells
Ab Initio Mechanistic Study on the Charging/Discharging Behaviors of the Layered-layered Lithium-rich Composite Cathode for Lithium-ion Batteries
An Experimental and Computational Approach to Properties of Mg2TiO4: Mn+4 Red Emitting Phosphor
Analysis for Formation of Kirkendall Voids during Solid-state Annealing in the Cu/Sn System
Calorimetric Investigation of the Liquid Sn-3.8Ag-0.7Cu Alloy with Minor Co Additions
Comparison of Electrotroless and Electroplating of Nickel Iron Alloy for the Diffusion Barrier of UBM
Contact-Resistance Reduction for Cu(Ti)/Conductive-Oxide-Film Junctions
Creep-induced Voiding in Sn phase of Pb-free Solder Joint
Development of High Strength and High Electrical Conductivity of Cu-Ni-Al Alloys
Dissolution Behavior of Ni Substrate and Ni3Sn4 Phase in Molten Lead-free Solders
Effect of Cu Surface Microstructure on Surface Oxidation and Soldering Wettability
Effects of Electroless Copper Bath Compositions on the Adhesion of Cu/Substrates in PCB
Effects of Electroplating Formula on the Void Formation at the Sn/Electroplated Cu Interface
Effects of Electromigration on the p-Bi2Te3/Sn Interfacial Reactions
Electrochemical Evaluation of Copper Etchant to Reduce the Galvanic Etching in Cu/Au Coupled Pads
Failure Mechanism of Cu6Sn5 Microbumps under Current Stressing
Formula Optimization of Titanium Dioxide Paste for Dye-sensitized Solar Cells
Interfacial Reactions between Tin and Ni-coated Bi2Te3
Interfacial Reactions in the Ni/Ag-Sb and Ni/Ag-Ge Couples
Investigation on the Phase Stability of Perovskite in La-Sr-Cr-Fe-O System and Its Long-term Operation
Kinetic Study of Silver Electrocrystallization on Silane-grafted Flexible Indium-oxide Substrate
Kinetics of Low-temperature Copper-Germanide Formation for Applications on Flexible Substrates
Liquidus projection and thermoelectric property of (Cu,Ag)–Ga–Te Thermoelectric Materials
Low-temperature Pressure-less Silver-to-silver Direct Bonding at Ambient Condition: Part I-Experimental Study
Low-temperature Pressure-less Silver-to-silver Direct Bonding at Ambient Condition: Part II-Mechanistic Study
Low Temperature Au to Au Direct Bonding by Highly <110>-oriented Au Films
Low Temperature Copper to Copper Direct Bonding with Different Thickness of (111) Nanotwinned Cu
Material Issues in Memristive Devices
Morphological Stability of Interfaces under Electromigration Condition: Insights from Phase-field Study
Phase Equilibria of the Sn-Fe-Ni Ternary System at 270oC
Phase Equilibria of Thermoelectric Ag-Bi-Se System
Probing Phase Transformations at the Nanoscales – Synchrotron X-ray Microdiffraction for Advanced Applications in Microelectronics, Phase-Change Memory and Solar PV Devices
Rapid Formation and Phase Transformation of Intermetallic Compounds Interconnection under Stress Current at Ambient Temperature
Stress and Currents Density Effects on Copper-Tin Intermetallic Compound Formation
Strong Inhibition of IMC Growth at the Sn/Co System by Minor Ga Addition
The Development of Alumina Nanofluid-based Electrolyte for Thermogalvanic Cells
The Kinetic Analysis of Co-Sn Binary System
Thermal Stabilities and Properties of AgBiS2 and AgBi3S5: a Review and Experimental Study
Tunable Surface Wettability and Adhesivity of Nitrogen-doped Graphene Foam
Using Sn-Bi Solder as the LED Die-attach Material by Controlling the Sn-Bi Composition and the Roughness of the Substrate

Questions about ProgramMaster? Contact