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Meeting 2010 TMS Annual Meeting & Exhibition
Symposium Failure of Small-Scale Structures
Sponsorship The Minerals, Metals and Materials Society
TMS Materials Processing and Manufacturing Division
TMS Structural Materials Division
TMS/ASM: Mechanical Behavior of Materials Committee
TMS: Nanomechanical Materials Behavior Committee
Organizer(s) Marian S Kennedy, Clemson University
Brad Boyce, Sandia National Laboratory
Reinhold Dauskardt, Stanford
Zhiwei Shan, Hysitron Inc
Scope The creation of small-scale structures ranging from thin film electronic systems to micro fuel cells has been prevalent within industry, academia and national laboratory research over the last fifty years. As fabrication methods have improved, designs have migrated to smaller length scale components and the push toward characterizing reliability of these small-scale structures has highlighted the existence of competing failure mechanisms. This symposia will focus on failures in small scale structures (flexible and semiconductor electronic systems, actuators, resonating cantilever, biological systems, fuel cells, MEMS devices, etc) and will discuss combinations of possible failure mechanisms. Possible mechanisms could include, but are not limited to: electromigration, diffusion, crack formation and propagation, oxidation, corrosion, fatigue (thermal, corrosion, cyclic), creep, delamination, etc. Both experimental and modeling of these events are encouraged, as well as analysis of statistical variation.

Proposed systems of interest:
Flexible and Semiconductor Electronic Systems
Small-scale sensors and actuators
Resonating cantilevers
Biological systems
Fuel Cells
MEMS/NEMS Devices
Abstracts Due 11/15/2009
Proceedings Plan Undecided
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

A Combined Experimental and Simulation Study to Examine Lateral Constraint Effects in Ni Superalloy Microcrystals
An In Situ Scanning Electron Microscopy Study of Size Dependent Mechanical Behaviors of Metallic Nanowires
Buckle Driven Delamination in Thin Gold Film-Compliant Substrate Systems
Competing Roles of Deformation and Void Formation during Rapid Thermal Cycling of Metal Interconnects
Deformation and Fracture in Human Skin
Deformation Mechanisms in Quasi-1D Nanostructures: In Situ Observations and Measurements during Tensile Testing in Electron Microscopes
Exploiting Delamination to Fabricate Microcontact-Printed MEMS
Failure of Micron-Scale Polysilicon MEMS: Fatigue and Wear Mechanisms
Failure of Protein Materials in Extreme Conditions and Disease
Finite Element Simulation Of Galvanic Corrosion In Silicon Microsystems
Fracture and Deformation in Metallic Nanowires
Fracture Behavior of Partially-Sintered Ceramics for Electrochemical Cell Applications
Fracture Properties of Fuel Cell Membranes
In-Situ Atomic Scale Nanomechanics Revealed by a TEM-SPM Platform
In-situ Micromechanical Testing
In-Situ Microscale Fatigue Study to Determine the Effect of Microstructural Neighborhoods on Crack Initiation Mechanisms and Lifetimes
In-Situ TEM Studies of Nanomechanics and Fracture in Nanowires and Nanotubes
In-Situ Tensile Deformation of Silver Nanowires
Insights from Nanomechanical Testing: Nanoengineering Surfaces, Thin Films, and Nanowires
Interface Fracture and Fatigue of Thin Metallic Films on Substrates
Investigation of the Deformation Mechanism of Gum Metal by In Situ TEM Nanocompression Testing
Mechanical Behavior of Au Nanowires
Mitigation of Wear-Induced Failure of Microsystems by Vapor Phase Lubrication
Nitinol Fatigue – A Review
Prestraining and Annealing of Gold Micropillars: Strengthening and Weakening Turned Upside Down
Size-scale Effects in the Fracture of Polycrystalline Silicon for Microsystems
Size Dependent Deformation in Polymers - Experiments and Theory
SIZE MATTERS: Nano-scale Mechanical Properties of Single Crystals, Nanocrystalline Metals, and Amorphous Metallic Glasses
Statistical Effects on Material Strength at Small Length Scales
Strain Rate Sensitivity Effects on the Failure of Metal Films on Compliant Substrates
The Role of Grain Boundaries in the Creep of Sub-micrometer Thick Cu and Cu/Si3N4 Microbeams at 300 K.
Theta-like Specimens to Determine Tensile Strength at the Micro Scale
Tuning the Mechanical Properties of a Nanoporous Gold
Visualization of Failure Mechanisms in Nanocrystalline Thin Films


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