| About this Symposium |
| Meeting |
2016 TMS Annual Meeting & Exhibition
|
| Symposium
|
Mechanical Behavior at the Nanoscale III
|
| Sponsorship |
TMS Materials Processing and Manufacturing Division
TMS: Nanomechanical Materials Behavior Committee
|
| Organizer(s) |
Daniel S Gianola, University of California, Santa Barbara
Ting Zhu, Georgia Institute Of Technology
Julia R Greer, California Institute of Technology
Harold Park, Boston University
Garritt J. Tucker, Colorado School of Mines
Jiangwei Wang, Zhejiang University |
| Scope |
This symposium focuses on materials that exhibit mechanical behavior and properties dominated by geometric and structural features at the nanometer scale. Research, development and application of materials characterized by small volumes or reduced dimensionality – such as nanoparticles, nanowires, nanotubes, pillars, sheets and thin films – are of interest, as are microscale and bulk specimens that are characterized by an underlying material structure of nanoscale feature length, for example nanocrystals, nanolaminates/multilayer thick films and nanoporous foams. This symposium will cover observations of the mechanical behavior of nanoscale materials, through experiments and numerical simulations, as well as tools and techniques used to make those observations and develop a clearer understanding of the underlying physics and mechanics of material deformation. The symposium invites papers that cover topics that include:
- Unique mechanical behavior due to geometric (specimen) size effects
- Mechanical properties of elasticity, strength, plastic flow, fatigue and fracture that are highly influenced by nanoscale geometric and structural features
- Nanoscale mechanical testing
- In-situ testing and characterization of nanoscale materials and structures
- Atomistic and nanoscale modeling and simulation of material behavior
-Development of micro/macro-scale models of material behavior that incorporate nanomechanical deformation mechanisms
- Application of nanoscale materials in technology (e.g. MEMS/NEMS) |
| Abstracts Due |
07/15/2015 |
| Proceedings Plan |
Planned: A print-only volume |