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About this Symposium
Meeting 2014 TMS Annual Meeting & Exhibition
Symposium Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XIII
Sponsorship TMS Electronic, Magnetic, and Photonic Materials Division
TMS: Alloy Phases Committee
Organizer(s) Chao-hong Wang, National Chung Cheng University
Chih-Ming Chen, National Chung Hsing University
Jae-Ho Lee, Hongik University
Ikuo Ohnuma, Tohoku University
Clemens Schmetterer, Forschungszentrum Juelich, Inst.
Yee-Wen Yen, National Chung Che ng University
Shien Ping Feng, The University of Hong Kong
Shih-Kang Lin, National Cheng Kung University
Scope This is the 13th in a series of TMS symposia addressing the stability, transformation, and formation of phases during the fabrication, processing, and utilization of electronic materials and devices. Topics of interests include phase stability issues surrounding microelectronics packaging technology, phase formation and integrated circuit technology, and the phase stability and morphological evolution of novel electronic materials.
Abstracts Due 07/15/2013
Proceedings Plan Planned: Journal of Electronic Materials
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

Ag Decorated Al Nanoparticles as Novel Ink Materials for Printed Electronics Applications
Anodic Electrodeposition of Nanoporous Nickel Hydroxide with a Facile Patterning Technique
Channel Formation in Cu6Sn5 and Cu3Sn Layers during Reflowing
Characterization of Interfacial Reactions in Cu/In/Ni Joints at 280 OC
Chemical and Thermal Reductions of Carboxylate-protected Nanoparticle-based Ag Conductive Films
Comparison of Electro and Electroless Nickel Iron Alloy Plating for the Diffusion Barrier of UBM
CoSb3-InSb Isoplethal Section of Co-Sb-In Ternary Phase Diagram
Effect of Joint Thickness on Cu Consumption for Pb-free Solders under Current Stressing
Effect of Layer Direction on the Interfacial Reactions between Bismuth Telluride and Tin-based Solder
Effects of Bath Conditions on the Compositions and Physical Properties of Ni-Fe Alloy Electroplating
Electroplating Ni-Au Low Ohmic Contacts on Nanostructured Bi2Te3 Alloys
Electroplating of <111>-Oriented Nickel Using <111>-Orientated Nano-twinned Copper
Enhanced Diffusional Processes in Wire Bonding
Establish Electromigration-induced Failure Map for Flip-chip Sn/Cu Cathode Interface
Experimental Investigation and Thermodynamic Modeling of the Ternary Pb-Bi-Te System
Exploring Nature’s Missing Li4Me5O12 Defect Spinel Oxides by Ab Initio Calculations
Formation of Porous Cu3Sn Intermetallic Compounds during Current Stressing at High Temperatures in Low-bump-height Solder Joints
Ga-based Cu-to-Cu Interconnection with Pt UBM
High-temperature Soft Solders: The Ni-Sn-Zn Phase Diagram
Influence of Ni/Zn on the Interfacial Reactions between Sn-0.7Cu Solder and Cu Substrates
Interaction of Sn-Sb Based Solders with Nickel: Phase Equilibria in the Ternary Ni-Sb-Sn System
Interfacial Reaction and Mechanical Characterization of Sn-Ag-Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Case
Interfacial Reactions between Sn-4Ag-0.5Cu Solder and Ni-coated Bi2Te3 Substrate
Interfacial Reactions between Sn and Ni-xW Alloys
Interfacial Reactions of Sn-Zn Solders with Pd and Au/Pd/Ni Substrates
Kinetics of Reactive Diffusion between Co and Sn at Solid-state Temperatures
Liquidus Projection of Thermoelectric Ag-Sn-Te Ternary System
Low-temperature Synthesis of Cu Interconnects on Glass Using Cu(Mg) Alloy Films
M2: Effect of Crystallographic Direction on the Sintering of ThO2 Nanoparticles
M3: Effect of Bump Height on Electromigration Failure Mode in Sn2.3Ag Solder Joints with Cu and Ni Metallization
M4: Effective Suppression of Sn-58Bi/Cu Interfacial Reactions with Minor Ga Addition
M5: Solid-state Reactions by Surface and Bulk Diffusion between Sn-based Solder and Ag Substrate
M6: Crystallization and Damage Evolution of Nickel-phosphorus Films on Glass Wafer during Mechanical and Thermal Fatigue
Metallization on Indium Tin Oxide Plastic Substrate by Potential–sweeping Electroplating
Microstructure and Phase Transformation of Cu-Sn Intermetallics in Microbumps
Periodic Layer Formation in the Au-12Ge/Ni Diffusion Couple
Shear-strength Improvement of ENIG/Sn-Bi/Ag/Cu Sandwich Structure by Doping Ag, Cu, or Zn Metals
Suppression of Cu3Sn in High Cu Content Pb-free Solders
Synthesis of Low Contact-resistance Cu(Ti)/ITO Junctions
Synthesis, Microstructures and Properties of High Strength-high Conductivity Cu-Mg Alloys
TEM Studies of Solid Phase Epitaxial Growth of 3C-SiC Thin Film on Si (001)
Temperature Dependent Mechanical Testing on the Formation of Cu/Sn Intermetallic Thin Films
The Crystalinity of Tin under Current Stressing
The System Cu-Li-Sn: Phase Diagram and Thermochemistry
Thermal Stability of Ruthenium Schottky Contact with 4H-SiC under Vacuum Annealing
Thermochemical Investigations on Phase Stabilities for Electrode Materials of Advanced Li-ion Batteries
Thermodynamic and Phase Relations of Intermetallic Anode Materials for Li-ion Accumulators
Thermodynamic Investigation of the Lithium–silicon–oxygen System for Lithium Ion Batteries
Wetting Behavior of Solders on ENIG and ENEPIG Metallization without Flux


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