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About this Symposium
Meeting 2021 TMS Annual Meeting & Exhibition
Symposium Hold for 2022: Nix Award and Lecture Symposium: Mechanistic Understanding of Mechanical Behavior Across Length Scales (Invited Abstracts Only)
Sponsorship TMS Materials Processing and Manufacturing Division
TMS: Nanomechanical Materials Behavior Committee
Organizer(s) Wendelin J. Wright, Bucknell University
Gang Feng, Villanova University
Scope This symposium will highlight research activities that have enhanced our fundamental understanding of deformation mechanisms that underpin the mechanical behavior of macro-, micro-, and nanoscale materials. Presentations will include studies of structural materials and thin films and will also comprise topics related to both strain gradient and nanoscale plasticity. Breakthroughs in fields that span from aerospace to microelectronics depend heavily on the availability of advanced materials that can be engineered and optimized at the nanoscale. Efforts to characterize, understand, and predict the mechanical behavior across scales will be emphasized.

This award symposium was established to honor William D. Nix and the tremendous legacy that he has developed and shared with the minerals, metals, and materials community and to highlight and promote continued progress and innovation relevant to research into the underlying mechanisms and mechanical behavior of macro-, micro-, and nanoscale materials.

William D. Nix’s research and seminal contributions to structural materials, thin films, and nanoscale plasticity have had significant impact on critical U.S. industries, spawned new fields of study, and motivated generations of researchers working in fields that span from aerospace to microelectronics. Breakthroughs in technologies for these critical industries depend heavily on the availability of advanced materials that can be engineered and optimized at the nanoscale. Nix’s groundbreaking contributions to our ability to characterize, understand, and predict the mechanical behavior and reliability of such materials have been critical enablers of these key technologies.

Abstracts Due 07/01/2020
Proceedings Plan Planned:
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE
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