||John W Elmer, Lawrence Livermore National Laboratory
Yan Li, Intel Corp.
Andre Lee, Michigan State University
Fan-Yi Ouyang, National Tsing Hua University
Srini Chada, Schlumberger
Kyu-Oh Lee, Intel Corp.
Kwang-Lung Lin, National Cheng Kung University
Christopher Gourlay, Imperial College
Daniel Lewis, Rensselaer Polytechnique Institute
Fan Gao, U. Masachusetts Lowell
||The symposium covers research advances in electronic interconnecting materials and their technologies, with special emphasis on Pb-free solders and new materials and structures for next-generation interconnects. Advances in microelectronic, optoelectronic and nanoelectronic devices continue to require new materials and technologies to meet the increasing electrical, thermal, mechanical, reliability, performance and environmental demands placed on interconnects and packaging at all levels. In this symposium, emerging interconnect and packaging technologies will be examined, as well as insights into existing technologies,including Pb-free and RoHS-compliant materials and processes.
Topics include, but are not limited to:
- Interconnect materials, manufacturing, and reliability from chip assembly to printed wiring board level interconnections
- Interconnects for emerging technologies, including 3D packaging, through silicon vias (TSVs),wafer level package (WLP),interconnects on flexible electronic modules and nanomaterials technology
- Pb-free solder reliability, including tin whisker formation and mitigation, electromigration,thermomigration,thermal aging and stressing, thermomechanical reliability, thermal and mechanical fatigue, and drop performance.
- Pb-free solder intermetallic compound (IMC)formation,crystallography, mechanical an physical properties,thermodynamics,and kinetics
- Advanced characterization methods as applied to interconnect technology including EBSD,TEM,synchrotron x-ray micro-diffraction, synchrotron and conventional 3D x-ray radiography and computed tomography.
- Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics
- Fundamental materials behavior including phase transformations,computational thermodynamics,solidification, microstructure evolution, corrosion, mechanical, thermal,and electrical properties of solders and IMCs.
- Continuing challenges in implementing Pb-free solders and RoHS-compliant
materials including materials compatibility,wetting, phase transformations, void formation and growth, IMC formation, and interconnects on flexible and low temperature substrates.