ProgramMaster Logo
Conference Tools for 2015 TMS Annual Meeting & Exhibition
Login
Register as a New User
Help
Submit An Abstract
Propose A Symposium
Presenter/Author Tools
Organizer/Editor Tools
About this Symposium
Meeting 2015 TMS Annual Meeting & Exhibition
Symposium Pb-Free Solders and Emerging Interconnect and Packaging
Sponsorship TMS Functional Materials Division (formerly EMPMD)
TMS: Electronic Packaging and Interconnection Materials Committee
Organizer(s) John W Elmer, Lawrence Livermore National Laboratory
Yan Li, Intel Corp.
Andre Lee, Michigan State University
Fan-Yi Ouyang, National Tsing Hua University
Srini Chada, Schlumberger
Kyu-Oh Lee, Intel Corp.
Kwang-Lung Lin, National Cheng Kung University
Christopher Gourlay, Imperial College
Daniel Lewis, Rensselaer Polytechnique Institute
Fan Gao, U. Masachusetts Lowell
Scope The symposium covers research advances in electronic interconnecting materials and their technologies, with special emphasis on Pb-free solders and new materials and structures for next-generation interconnects. Advances in microelectronic, optoelectronic and nanoelectronic devices continue to require new materials and technologies to meet the increasing electrical, thermal, mechanical, reliability, performance and environmental demands placed on interconnects and packaging at all levels. In this symposium, emerging interconnect and packaging technologies will be examined, as well as insights into existing technologies,including Pb-free and RoHS-compliant materials and processes.

Topics include, but are not limited to:

- Interconnect materials, manufacturing, and reliability from chip assembly to printed wiring board level interconnections
- Interconnects for emerging technologies, including 3D packaging, through silicon vias (TSVs),wafer level package (WLP),interconnects on flexible electronic modules and nanomaterials technology
- Pb-free solder reliability, including tin whisker formation and mitigation, electromigration,thermomigration,thermal aging and stressing, thermomechanical reliability, thermal and mechanical fatigue, and drop performance.
- Pb-free solder intermetallic compound (IMC)formation,crystallography, mechanical an physical properties,thermodynamics,and kinetics
- Advanced characterization methods as applied to interconnect technology including EBSD,TEM,synchrotron x-ray micro-diffraction, synchrotron and conventional 3D x-ray radiography and computed tomography.
- Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics
- Fundamental materials behavior including phase transformations,computational thermodynamics,solidification, microstructure evolution, corrosion, mechanical, thermal,and electrical properties of solders and IMCs.
- Continuing challenges in implementing Pb-free solders and RoHS-compliant
materials including materials compatibility,wetting, phase transformations, void formation and growth, IMC formation, and interconnects on flexible and low temperature substrates.
Abstracts Due 07/15/2014
Proceedings Plan Planned: A print-only volume
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

Ag Stress Migration Bonding
Al, Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics
Back-fill Sn flux against Current-Stressing at Cathode Micro Cu/Sn Interface
Deformation of Copper through-Silicon via under Thermal Cycling
Development of a Fracture Mechanism Map for Thin Solder Joints with High Intermetallic Content
Development of Interconnection Technology for Double Side Power IC Module
Development of Pb-Free and Halogen-Free Nanosolder Paste for Electronics Assembly and Packaging
Development of Pb-Free Composite Solder Paste by Liquid-Phase Diffusion Bonding for High Temperature Applications
Effect of Solute Addition and Grain Structure Modification on Boundary Diffusion and Whisker Growth in Tin Coatings
Effect of Temperature on Thermomigration of Solder Joints
Elastic Constants of Cu6Sn5: Resonant Ultrasound Spectroscopy Experiments and Validation by Atomistic Simulation
Electro-Migration Study in First Level Interconnects
Electrochemical Study of Cu-Al IMCs for Service Reliability of Wire Packages
Electromigration Failure Mechanism of Cu/SnAg/Ni Microbumps in Three-Dimensional Integral Circuits Using Kelvin Bumps Structure
Electromigration in 3D-IC Scale Cu/Sn/Cu Solder Joints
Enhancing the Impact Properties of Tin-Copper and Tin-Copper-Nickel Lead-Free Solders with Trace Additions of Zinc, Indium and Gold
Evolution of Electromigration Damage in Idealized SnAgCu 305 Interconnects
F76: On the Melting Temperature and Phase Diagram Prediction in the Sn-Rich Corner of Sn-Ag-Cu Nano Alloys
F77: 3D Structure of Nanoporous Sintered Silver
F78: A First-Principles Investigation of Dislocation Core Properties of -tin
F79: Anisotropic Thermal Expansion of Ni3Sn4, Cu6Sn5 and Beta-Sn: A Powder XRD Study
F80: Characterization of Tin Whiskering and Influence of Microstructure on Its Formation
F81: Combined Effects of Solidification Thermal Parameters and Microstructural Features on Mechanical Properties of Directionally Solidified Sn-Sb Lead-Free Solder Alloys
F82: Cu-Al Intermetallics for Grain Refinement of Primary Cu6Sn5 in Sn-xCu (x=0.7 to 7.6wt%) Solders
F83: Effect of Joint Length on Void Formation and Intermetallic Compound Dissolution for Pb-Free Solders during Electromigration
F84: Effect of Temperature Gradient on the Growth of Ag3Sn Intermetallic Compounds in Pb-Free Solder during Thermo-Compressive Bonding Process
F85: Effect of Volume Confinement on the Formation of Void in Solder Joint
F86: Electromigration Failure Modes of Microbumps with Different Underbump Metallizations in 3D IC Packaging
F87: Improvement of Thermal Fatigue Property at Bi Based Alloy
F88: Influence of Nano-Structured Modifiers on Mechanical Reliability of Sn-Cu Solder Alloys
F90: Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for High Reliability of Automobile ECU
F91: Optimization of AuSn Eutectic Bonding Using Thermal Evaporation Process
F92: Phase Equilibria in the Bi-Rich Corner of the Ag-Bi-Ni System
F93: Plasma Organic Surface Finish – Solder Wettability and Multi-Reflow Properties
F94: Solder Joint Reliability of Sn-48Bi-2Ag Ribbon for Solar Cell Module
F96: The Conditional Probability Density Distribution Surface of the Pb-Free Solder Joint Fatigue Properties under Board Level Drop Impact
F97: Viscosity Studies of Liquid Nano-Composite Sn-Ag-Cu Alloys
F99: Phase Formation, Transformation and Stability in Micro-Alloyed Sn-Based Lead-Free Solder Alloys and Joints
Grain Refinement of Bulk Cu6Sn5 in SAC-Al and SnCu-Al Solders (New title)
Heat Flow and Microstructural Evolution Associated with the Use of Self-Propagating Reactive Multilayer Foils on a Tin-Based Alloy Substrate
Heterogeneous Nucleation of β-Sn in Aluminum-Modified Lead-Free Solder Alloys
Impact of Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High G Mechanical Shock Performance
Impact Strength of Sn-Bi/Cu Joints Soldered by Laser Process
In-Situ Imaging of Sn-Cu Lead-Free Soldering on Cu Substrates: Intermetallic Compound Formation and Growth
In Situ Observations of Micromechanical Behaviours of Intermetallic Compounds for Structural Applications in 3D IC Micro Joints
In Situ Visualization of One-Dimensional Cu/Sn Diffusion Couples for Nanomaterials Assembly and Interconnection
Interfacial Reaction of Fine Pitch Cu/Sn-Ag Pillar Bump on Cu/Zn and Cu/Ni UBM
Investigating the Influence of Process and Service Conditions on the Microstructure of TLP Bonded Si/SiC Chips Using (Ag,Ni-)Sn Interlayers
Investigation of Deformation-Induced Sn Whiskers for Growth Mechanism and Mitigation Method
Low-Temperature and Low-Pressure Direct Copper-to-Copper Bonding
Mechanical Properties after Ageing of Sintered Ag as a New Material for Die Bonding: Influence of the Microstructure Evolution
Mechanical Property Variations of Intermetallics in Space-Confined Ni/Sn/Cu Diffusion Couples
Mechanical Response of Pb-Free Solder Joints after Current Stressing
Microstructural Evolution of the Intermetallic Compounds in the TCNCP Solder Joint during Pre-Con and TCT Tests
Microstructure Evolution and Stress-Strain Analysis of Wafer Level Chip Scale Package Corner Joints with Different Thermal Conditions and Thermal Cycles Using In-Situ HE-XRD Method
Nucleation and Growth of Thermally-Induced Sn Whiskers and Their Relation to Plastic Strain Relaxation
Packaging and Failure Analysis Challenges in Advanced 3D Packages
Phase Evolution of Sn/In Nanosolder Particles at Elevated Temperatures
Quantifying the Anisotropy of Sn-Based Solder Alloys by Micropillar Compression Experiments: Influence of Size, Grain Boundaries and Precipitates
Sinter Joining with Shape-Controlled Silver Particles for Low Pressure-Low Temperature Die-Attach
Slip Parameters for Crystal Plasticity Finite Element Analysis of Cu6Sn5 Single Crystal Intermetallic in Solder Joint: Experiment, Modeling and a Comparative Analysis
Solidification Rate and Al Concentration Effects on Cu-Al Intermetallic Phases in Pb-Free Solders: Implications for Solder Joint Microstructure Control
Strength of MWCNT Reinforced 70Sn–30Bi Solder Alloys
Study of Grain Size and Orientation of 30 μm Solder Microbumps Bonded by Thermal Compression
Synthesis and Characterization of Sn-Ag-Cu Alloy Nanoparticles
Synthesis and Characterization of Sn Coating on MWCNT Using DBA as Capping Agent
The Dissolution and Supersaturation of Zn in the Sn9Zn Solder under Current Stressing
The Influence of Metastable NiSn4 in Joints between Sn-Ag Solders and ENIG Substrates
The Performance of Solid Solution Strengthened no Silver Lead Free Solder in Elevated Temperature Service
Thiol-Based Self-Assembled Monolayers (SAMs) as an Alternative Surface Finish for 3D Cu Microbumps
Understanding the Behavior of Solder Joints Subject to Harsh Environments Using Multi-Scale Characterization Techniques
Wettability and Interfacial Characteristic of Sn-Bi-Cu Solder on Ni Substrates
In-Situ Tensile Behavior of Tin Whiskers


Questions about ProgramMaster? Contact programming@programmaster.org