| Organizer(s) |
Kwang-Lung Lin, National Cheng Kung University
Sung K. Kang, IBM
Jenq-Gong Duh, National Tsing-Hua University
Laura Turbini, Research In Motion
Iver Anderson, Iowa State University
Fu Guo , Beijing University of Technology
Thomas Bieler, Michigan State University
Andre Lee, Michigan State University
Rajen Sidhu , Intel Corporation |
| Scope |
The ever expanding utilization of Pb-free solders in advanced electronics has raised increasing interest and concern regarding the materials system, packaging technology, phase transformation, interfacial interaction, reliability of the electronic packages, and many other aspects. Research activities dealing with Pb-free solders are rather multidisciplinary. This symposium will solicit papers in the following subjects, but not limited to:
• Solder materials and soldering technology
New alloy development, Pb-free solders, Pb-containing solders, metallizations for soldering, diffusion barrier, etc.
• Solder interconnects from chip level to board level packaging and the reliability issues
Electro-migration, IMC formation, Tin whisker, diffusion, oxidation and corrosion, challenges in implementing solder interconnects, etc.
Reliability issues including drop test, impact test, thermal cycle,Thermal aging, and other accelerating tests, materials compatibility,etc.
• Solder material behaviors
Phase transformations, microstructure evolution, interfacial reactions, wettability, mechanical, thermal, and electrical properties,computational materials science and modeling,etc.
• Interconnects for emerging technologies
3D chip stacking
Optoelectronic interconnects
2-D and 3-D self assembly of dielectrics and electrical conductors
Nano-materials-based interconnects
Interconnects for flexible inorganic and organic electronics |