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About this Symposium
Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Sponsorship TMS Functional Materials Division
TMS: Electronic Packaging and Interconnection Materials Committee
Organizer(s) Yan Li, Intel
Tae-Kyu Lee, Portland State University
Albert T. Wu, National Central University
Kwang-Lung Lin, National Cheng Kung University
Chih Chen, National Chiao Tung Univ
Won Sik Hong, Korea Electronics Technology Institutue(KETI)
Mehran Maalekian, AIM Metals & Alloys
Kazuhiro Nogita, The University of Queensland
Christopher M. Gourlay, Imperial College London
Scope Scope: Continuing advances in microelectronic, optoelectronic and nanoelectronic devices require new materials and technologies to meet the increasing electrical, thermal, mechanical, reliability, performance and environmental demands placed on interconnects and packaging at all levels. This symposium will address current researches in Packaging Materials and Process, including Pb free solder, alternative interconnects, conductive adhesive, epoxy, substrates, 3D packaging, wafer level packaging, quality, reliability, and failure analysis.

Topics of interest include, but are not limited to:

* Packaging materials and Process for next generation packages, e.g., 3D packaging, wafer level packaging, photonic packaging, Internet of Things (IoT), flexible electronics, wire bonding, automotive and power electronics.
* Interconnects for packages, e.g., Pb-free solder, micro bumps, Through-silicon-vias (TSVs), direct Cu to Cu bonding, wire bonding, conductive adhesive, optoelectronic interconnects, transient liquid phase bonding, sintered nano-powder joints, and alternative interconnect materials at chip and package levels.
*Additive manufacturing and 3D printing for electronics industry
* Other packaging materials e.g., epoxy, molding compounds, epoxy flux, thermal interface material (TIM), substrate materials and process.
* Quality, Reliability, and failure analysis for next generation packages.
* Continuing challenges in implementing Pb-free solders for interconnect, plating and thermal interface material (TIM) applications
* Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics
* Developments in low temperature Pb-free solder alloys and fine pitch solder joints
* Electromigration, thermomigration, stress-migration and mechanical effects
* Whisker growth in Sn, Sn-based alloys and other metallic systems
* Advanced characterization methods as applied to interconnect technology
* Fundamental materials behavior including phase transformations, computational thermodynamics, solidification, microstructure evolution, corrosion, mechanical, thermal, and electrical properties of solders and intermetallic compounds
Abstracts Due 07/16/2017
Proceedings Plan Planned: TMS Journal: Journal of Electronic Materials
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE
No additional information can be displayed at this time.


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