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Meeting 2015 TMS Annual Meeting & Exhibition
Symposium Advanced Materials for Power Electronics, Power Conditioning, and Power Conversion III
Sponsorship TMS Functional Materials Division (formerly EMPMD)
TMS: Energy Conversion and Storage Committee
TMS: Magnetic Materials Committee
Organizer(s) Paul Ohodnicki, National Energy Technology Laboratory
Michael Lanagan, Penn State University
Michael McHenry, Carnegie Mellon University
Rachael Myers-Ward, Naval Research Laboratory
Clive Randall, Penn State University
Matthew Willard, Case Western Reserve University
Ty McNutt, APEI, Inc.
Scope Independent of the means by which electrical power is generated (conventional fossil, advanced fossil, nuclear, solar, wind, etc.), power conditioning and conversion is required to transform power into an appropriate form for efficient and cost-effective integration into the grid. By 2030, it is also projected that 80% of all electricity will flow through power electronics. Advanced materials including soft magnetic materials, semiconductors, and dielectric materials for capacitors are crucial for enabling the next generation of advanced power electronics technologies. These technical communities have historically worked independent of one another and materials development efforts have often been carried out in the absence of frequent and meaningful interactions with the power electronics community.

The proposed symposium aims to bridge these historical gaps through a number of technical symposia devoted to relevant materials systems including soft magnets, dielectric materials for capacitors, and semiconductor materials. The primary focus of the proposed symposium will be in the area of advanced materials for power electronics and power conditioning systems. A range of invited and contributed talks will be presented by the top materials scientists in each field. To supplement the traditional technical sessions, a selected group of technical experts from the power electronics community will also be invited to present and to engage the materials community. These invited talks are intended to promote interactions between the materials and power electronics communities, to educate the materials community about critical materials needs, and to educate the power electronics community about state-of-the-art material developments.
Abstracts Due 07/15/2014
Proceedings Plan Planned: A print-only volume

A Nanosilver Paste Technology for Pressure-free Bonding of Power Semiconductor Chips
Advanced III-V Technologies for RF Power Applications
Advanced Materials for High Temperature, High Performance Wide Bandgap Power Modules
Basic Mechanisms Affecting the Reliability of SiC Power MOSFETs
Carbon Microelectromechanical Systems (C-MEMS) Based Microsupercapacitors
Cubic Pyrochlore Bismuth Zinc Niobate Thin Films for Dielectric Energy Storage
Development of PLZT-based Ceramic Capacitors for Power Electronics in Electric Drive Vehicles
Development of Predictive Tools for Self-Healing Behavior in Coated-Glass Systems
Glass Capacitors for Power Electronics
High Power Transformer Testing and Applications
HV Wide Bandgap Semiconductors Demand Materials Evolution
Improved Performance in AlGaN/GaN Power HEMTs-on-Silicon by Use of Pulsed MOCVD Technique and Stress Engineering
Laminated Aluminum/Graphite Composite Roll with High Thermal Conductivity and Thermal Stress Relaxation Effect
Origin of Low Frequency Noise in the Low Drain Current Range of AlGaN/GaN High-Electron-Mobility Transistors(HEMTs)
Physics Based Simulation of 4H-SiC DMOSFET Structure Under Inductive Switching
Recent Development of LTCC Technologies Designed for Nonconventional Applications
Status of Large Diameter SiC Single Crystal Substrates for Semiconductor Applications
Thin Films of Barium Oxide Based Glasses for Dielectric Material
Very High Voltage SiC Power Switches with Superior Energy Efficiency and Integrated SiC Drive Electronics
Zirconium and Calcium Modified BaTiO3 Thin Films for Electrical Energy Storage Applications
(1-x)BaTiO3-xNaNbO3 Complex Perovskite Relaxor Ferroelectrics for High Temperature Capacitor Applications

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