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Meeting 2016 TMS Annual Meeting & Exhibition
Symposium Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
Sponsorship TMS Functional Materials Division (formerly EMPMD)
TMS: Electronic Packaging and Interconnection Materials Committee
Organizer(s) Albert T. Wu, National Central University
Yan Li, Intel
Kazuhiro Nogita, The University of Queensland
Christopher M. Gourlay, Imperial College London
Scope Continuing advances in microelectronic, optoelectronic and nanoelectronic devices require new materials and technologies to meet the increasing electrical, thermal, mechanical, reliability, performance and environmental demands placed on interconnects and packaging at all levels. This symposium will address current researches in microstructure-design, processing and properties of new and existing materials for emerging interconnects with special emphasis on Pb-free materials for advanced packaging technologies.

Topics of interest include, but are not limited to:
 Emerging interconnect materials and technologies, e.g., 3D stacking including through-silicon-vias (TSVs), optoelectronic interconnects and flexible electronics
 Continuing challenges in implementing Pb-free solders for interconnect, plating and TIM applications
 Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics
 Non-solder interconnect materials at chip and package levels
 Electromigration, thermomigration, stress-migration and mechanical effects
 Whisker growth in tin, tin-based alloys and other metallic systems
 Advanced characterization methods as applied to interconnect technology
 Fundamental materials behavior including phase transformations, computational thermodynamics, solidification, microstructure evolution, corrosion, mechanical, thermal, and electrical properties of solders and IMCs
Abstracts Due 07/15/2015
Proceedings Plan Planned: A print-only volume

Development of Interconnection Technology for Double Side Power IC Module
Die-attach Structure Using SiC Particle Added Ag Paste for Ultra High Thermal Stability Usage
Effect of Ag, Ni and Bi Additions on Melting and Solderability of Lead-Free Solders
Effect of Bump Height on Grain Size and Orientation of Solder Microbumps Bonded by Thermal Compression
Effect of Crystal Orientation and Microstructure on the Nucleation and Growth of Tin (Sn) hillocks by In Situ Nanoindentation and Electron Backscattered Diffraction (EBSD)
Effect of Electromigration on Crystal Orientation in Wafer Level Chip Scale Package Using Synchrotron X-ray Diffraction
Effect of Kirkendall Void Formation in Cu3Sn on Mechanical Properties of IMCs-based Microbumps
Effects of Bi on Microstructure Formation and Properties of Sn-Cu-Bi Based Solders
Effects of Composition and Assembly Processes on the Microstructure and Reliability of Various Lead Free Solder Alloys
Effects of Nanosized Ceramic Additions on Microstructure and Mechanical Properties of Sn3.0Ag0.5Cu Composite Solder
Electrical Conductivity of Porous Silver Made by Annealing Silver Nanoparticles for Short Periods
Electrochemical Migration of Fine Pitch Ag Interconnects
Electromigration and Thermomigration in Eutectic SnBi Solder Joints
Electromigration Failure in Microbumps with Different Grain Sizes
Electromigration in Ni/SnAg/Ni Microbumps with 15μm Solder Height
Enhanced Stabilization of η Cu6Sn5 in Pb-free Solder Joints
Estimation of Constitutive Parameters in beta-Sn by Instrumented Nanoindentation and Crystal Plasticity Simulation
Fabrication and Electrical Characterization of Hybrid CNT/Copper Composite Material
Failure Mechanism of Ag Alloy Wire Bonding for Electronic Packaging under Electromigration Test
Failure Morphology of Lead-free Sn-3.0Ag-0.5Cu Solder Joint under Low-G Drop Impact
FCBGA Mechanical Shock Performance Enhancement at Elevated Temperature Using Edgebond Material
FF-1: Density, Surface Tension and Viscosity of ZnAl+X (X= Li, Na, Si) Alloys
FF-2: Development of a Microwave Sintered TiO2 Reinforced Sn-0.7wt%Cu-0.05wt%Ni Solder Alloy
FF-3: Effect of Bi on Mechanical Properties and CTE of Pb-free Solders
FF-4: Effects of Trace Addition of Phosphorus in Sn-Cu-Ni Solders
FF-5: Joint Properties of Sn-Cu-(X)Al(Si) for Automotive Electronics Modules
FF-6: Microstructural Evolution during Processing of Sintered Joints
FF-7: Microstructure and Properties of BGA Joints Soldered with Sn-Cu-Ni-Bi
FF-8: The Effect of Aging Temperature on the Phenomena Occurring at the Interface of Solder SnZn with Na on Cu Substrate
Fracture Reliability Concern of (Au,Ni)Sn4 Phase in 3D IC Microbumps Using ENIG Surface Finishing
Growth Kinetic of Ni3Sn4 Intermetallic Compounds in Pb-free Interconnect under a Temperature Gradient
High Temperature Tensile Creep Behavior in Eutectic AuSn Solder
Identifying Alternative Formulations for Transient Liquid Phase Bonding
In Situ FIB/SEM Tensile Testing of Tin (Sn) Whiskers
In Situ Mechanical Testing of Micro-Scale Solder Joints
Influence of Corrosive Electrolyte on the Electrochemical Behavior of Cu(Pd)-Al IMCs
Influence of Surface Finish on the Formation of Intermetallic Compounds during Reflow Soldering: In-situ Real-time Observations
Influence of the Substrate on the Nucleation of Tin in Solder Reactions
Interactions between Electromigration and Thermal Fatigue of Pb-free Interconnects
Interfacial Sliding due to Stress, Electromigration and Thermal Gradient and Effect on Through-Silicon Via Structures
Investigation of Anisotropic Micromechanical Behaviors of Cu6Sn5 by In-Situ Micropillar Compression
Lead Free Solder Joint Open Failures Post Multiple Reflows due to Void Generation and Accumulation
Marker Analysis to Determine Dominant Diffusing Species in Ni3Sn4
Mechanical Properties of Ni3Sn4 by Micropillar Compression and Nanoindentation
Microstructural Improvements of SAC Alloys with Bi Additions during Accelerated Thermal Cycling
Mitigation of Sn Whisker Growth by Dopant Addition
Modeling the Growth of Whiskers under Thermally-induced Strain
Nanoparticle-Reinforced Lead-free Solder Pastes for Electronics Assembly and Packaging
New Concept Solders/Interconnects for 3D Packaging
Nucleation Rates of β-Sn, Cu6Sn5, and CuxAly in Aluminum-Modified Lead-Free Solder Alloys
On the Evolution of the Nanoporous Microstructure of Sintered Ag during Ageing
Properties of a Cu-Ni / Sn-Alloy Powder Composite for Use as a High Temperature Lead-Free Solder
Reliability of Die Attach Using Ag Nanoporous Sheet for High Temperature Electronics
Sn-Ag-Cu Nanosolders: Reliability of the Solder Joints
Solder Wetting Behavior of Plasma Organic Surface Finish with Multiple Heat-Treatment
Study of Low Melting Solder Alloys
Synchrotron Radiation X-ray Measurement on Residual Stress in Sn Films and Kinetic Analysis of Sn Whiskers Growth
The Early Stage Wetting Behaviors between Solder and Cu
The High Temperature Performance of BiAgX As a Lead-Free Drop-In Solder
The Intermetallic Compound Formation for the Wire Bond between Al pad and Ag-xPd Alloy Wire
Ultrasonic Powder Consolidation of Sn/In Nanoparticles and Their Application for Low Temperature Cu-Cu Soldering
Using Sn-Bi-Zn Solder as the LED Die-attach Material by Controlling the Sn-Bi-Zn Composition and the Roughness of the Substrate
Wafer Level Au-Sn TLP Bonding from Eutectic Composition
WBG Die-attach Ceramic Substrate for Severe Thermal Cycling

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