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About this Symposium
Meeting 2016 TMS Annual Meeting & Exhibition
Symposium Recent Advancement on Stretchable and Wearable Electronics
Sponsorship TMS Functional Materials Division (formerly EMPMD)
TMS: Electronic Packaging and Interconnection Materials Committee
TMS: Nanomaterials Committee
TMS: Thin Films and Interfaces Committee
Organizer(s) Pooran Joshi, Oak Ridge National Laboratory
Amit Pandey, LG Fuel Cell Systems Inc.
Jiahua Zhu, The University of Akron
Nuggehalli M Ravindra, New Jersey Institute of Technology
Catherine Dubourdieu, CNRS - INL
Madan Dubey, US Army Research Lab
Scope Additive manufacturing and printed electronics technologies employing metal, dielectric, polymer, and ceramic materials have the potential to enable new products and markets. Advanced additive manufacturing and direct-write techniques in combination with rapidly expanding material and device sets and their application range have the potential to meet the cost and performance demands of future manufacturing technologies. The proposed symposium will focus on the emerging additive manufacturing concepts and techniques for the processing of 2D/3D structures and integration of functional electronic components and devices on engineered geometries. Additive manufacturing technology in combination with printed electronics has the potential to define path towards hybrid technology integration of sensors and electronics on engineered 3D geometries. Invited and contributed papers will discuss both the fundamental aspects underlying certain applications and the particular challenges regarding technology, fabrication processes, and reliability.
Research fields of interests are related but not necessarily limited to the following topics:
- Nanomaterials for 2D/3D additive manufacturing
- Additive manufacturing and characterization of 3D structures and geometries
- Printed electronics: materials, processes, and fabrication and characterization techniques
- Low thermal budget integration of functional inks and 2D/3D materials
- Multifunctional flexible and printed electronic devices: sensors, detectors, TFTs, antennas, batteries
- Hybrid electronics: merging printed electronics and additive manufacturing
Abstracts Due 07/15/2015
Proceedings Plan Planned: TMS Journal: Journal of Electronic Materials
PRESENTATIONS APPROVED FOR THIS SYMPOSIUM INCLUDE

3D Printing Liquid Metals at Room Temperature for Fabrication of Functional, Stretchable, and Soft Electronics
A New Architecture for Flexible Large-area Electronic Systems
B-1: Printing of Graphene-coated Copper Nano-ink on Flexible Substrate Using Light Sintering Method
DFT Approach to Electronic and Optical Properties of Foldable and Stretchable Graphene
Flexible Copper Clad Laminate prepared by Roll-to-Roll Additive Manufacturing
Inkjet Printed Metal Oxide Thin Film Transistors
Laser Writing and Photonic Reduction of High Performance Supercapacitors on Flexible Substrates
Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
Mechanical Stability of Printed Metallizations on Polymer Substrates
New Paradigms for Enabling Printing of Flexible Optoelectronics through Engineered Metal-organic Inks and Direct Writing
Post Processing and In Situ Processing for Low Thermal Budget Integration of Electronic Materials on Flexible Substrates
RF Devices based on 2D Materials for Flexible and Wearable Electronics
Self-sensing Ionic Polymer-metal Composite Soft Robotic Actuator Integrated with Gallium-indium Alloy
Silver Nanowire Networks for Flexible Electromagnetic Interface Shields
Ultrasonic Spray Printing for High-performance Flexible Organic Field-effect Transistors and Hybrid Perovskite Solar Cells
Wearable Energy Storage Devices from Cotton T-shirts
Wireless Gas Sensing with NFC-enabled Mobile Device


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