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Conference Tools for 18th International Conference on the Strength of Materials (ICSMA 18)
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Meeting 18th International Conference on the Strength of Materials (ICSMA 18)
Symposium 18th International Conference on the Strength of Materials (ICSMA 18)
Sponsorship
Organizer(s) Peter M Anderson, The Ohio State University
Irene J Beyerlein, University of California, Santa Barbara
James C. Earthman, University of California, Irvine
Michael John Mills, The Ohio State University
Timothy J. Rupert, University of California, Irvine
Izabela Szlufarska, University of Wisconsin
Scope This event will be held July 15-19, 2018 in Columbus, Ohio, USA, on the campus of The Ohio State University.

ICSMA 18 builds on a 50-year tradition of providing an international venue for the latest advances in the strength of materials. Scientific topics provide comprehensive coverage of the field, from basic concepts of deformation to advanced engineering materials, and across composites, alloys, biomedical and bio-inspired materials, and emerging materials. The meeting will advance fundamental understanding of the processes that govern the strength of materials at different length and time scales, and it will forge links between basic studies and investigations of technologically important engineering materials. Thus, ICSMA 18 will offer a broad forum for the presentation and discussion of all aspects related to the strength and deformation of a wide range of materials. The conference will be held at The Ohio State University (USA), providing an open campus setting in which to meet.

Topic areas include:
Advanced (including in situ) characterization of deformation processes
Elementary deformation mechanisms in engineering materials
Fracture and fatigue
Friction and wear
Glasses and non-crystalline solids
High-temperature deformation and creep
Materials under extreme conditions
Mechanical behavior associated with phase transformations
Mechanistic foundations for multiscale modeling and ICME
Micro-and nano-scale mechanical testing
Effects of grain boundaries and interfaces
Reinforcements at the sub-nanometer scale
Strength of biomedical and bio-inspired materials
Emerging topics
John P Hirth and Hael Mughrabi Honorary Symposia
Abstracts Due 01/15/2018
Proceedings Plan Undecided
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