| Scope |
New materials and technologies are required for the advances in microelectronic, optoelectronic and nanoelectronic devices to meet the increasing thermal, mechanical, reliability, electrical performance and environmental demands placed on interconnects and packaging at all levels. This symposium will address current researches in processing and properties of new and existing materials for emerging interconnects and 3D Interconnection materials for advanced packaging technologies.
Topics of interest include, but are not limited to:
- Emerging interconnect materials and technologies, e.g., 3D stacking including through-silicon-vias (TSVs), optoelectronic interconnects and flexible electronics
- High temperature Pb-free solders and associated interconnects for automotive and power electronics
- Low temperature Pb-free solders for advanced packaging technologies
- Continuing challenges in implementing Pb-free solders for interconnect, plating and TIM applications
- Non-solder interconnect materials at chip and package levels
- Electromigration, thermomigration, stress-migration and mechanical effects
- Whisker growth in tin, tin-based alloys and other metallic systems
- Advanced characterization methods as applied to interconnect technology
- Fundamental materials behavior including phase transformations, computational thermodynamics, solidification, microstructure evolution, corrosion, mechanical, thermal, and electrical properties of solders and IMCs |