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Meeting Materials Science & Technology 2019
Symposium Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
Organizer(s) Tae-Kyu Lee, Cisco Systems
Darrel R. Frear, Freescale Semiconductor
David P. Yan, San Jose State University
Albert T. Wu, National Central University
Scope New materials and technologies are required for the advances in microelectronic, optoelectronic and nanoelectronic devices to meet the increasing thermal, mechanical, reliability, electrical performance and environmental demands placed on interconnects and packaging at all levels. This symposium will address current researches in processing and properties of new and existing materials for emerging interconnects and 3D Interconnection materials for advanced packaging technologies.

Topics of interest include, but are not limited to:

- Emerging interconnect materials and technologies, e.g., 3D stacking including through-silicon-vias (TSVs), optoelectronic interconnects and flexible electronics
- High temperature Pb-free solders and associated interconnects for automotive and power electronics
- Low temperature Pb-free solders for advanced packaging technologies
- Continuing challenges in implementing Pb-free solders for interconnect, plating and TIM applications
- Non-solder interconnect materials at chip and package levels
- Electromigration, thermomigration, stress-migration and mechanical effects
- Whisker growth in tin, tin-based alloys and other metallic systems
- Advanced characterization methods as applied to interconnect technology
- Fundamental materials behavior including phase transformations, computational thermodynamics, solidification, microstructure evolution, corrosion, mechanical, thermal, and electrical properties of solders and IMCs

Abstracts Due 04/05/2019
Proceedings Plan Definite: At-meeting proceedings

A Model Study of Microstructure Evolution and Bi Diffusion in Sn-Bi Low Temperature Soldering Systems
Corrosion Behavior of Electroplated and Electroless Plating Ni/Pd/Au Surface Finish on Automobile Printed Circuit Board
Effect of Reducing Agent on the Joint Strength of Sintered-joint with Cu Paste
Effect of Thermal Annealing on Structural Integrity of Cu-filled-through Si Via (TSV)
Fabrication of Stress Free Ni-Co Coatings Using Electroplating Method
Heated Mechanical Cycling as a Substitute for Thermal Cycling - A Preliminary Investigation for a New Failure Analysis Technique
IMC Evolution as a Function of Grain Orientation under High Current Density in Sn-based Solder Joints
Instability Detection in Press-fit Connector Pin Interconnects after Thermo-mechanical Cycling
Interfacial Reactions in Co/Ag-Cu, Ni/Ag-Cu, Co/Ag-Sb and Ni/Ag-Sb Couples
Micro Interconnect Mechanical Stability in Cryogenic Temperature Environment
Micro Interconnect Shear and Creep Performance under Current Stressing
Microstructure Evolution in Cu and Ag Coated Cu Particle Sintering for Power Module Interconnection
Predicting Electromigration-mediated Damage in Interconnects Using Phase-Field Models
Stretchable Joint with Ag-PDMS for Wearable Electronics
Understanding Reliability Failure Mechanisms in Pb Free Solder Joint with Micro-gap Configuration

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