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Meeting 2018 TMS Annual Meeting & Exhibition
Symposium Recent Advances in Functional Materials for Printed, Flexible and Wearable Electronics
Sponsorship TMS Functional Materials Division
TMS: Thin Films and Interfaces Committee
Organizer(s) Pooran Joshi, Oak Ridge National Laboratory
Nuggehalli M Ravindra, New Jersey Institute of Technology
Jud Ready, Georgia Institute of Technology
Amit Pandey, LG Fuel Cell Systems Inc.
Suresh K. Sitaraman, Georgia Institute of Technology
Scope Additive manufacturing and printed electronics technologies employing metal, dielectric, polymer, and ceramic materials have the potential to enable new products and markets. Advanced additive manufacturing and direct-write techniques in combination with rapidly expanding material and device sets and their application range have the potential to meet the cost and performance demands of future manufacturing technologies. The proposed symposium will focus on the emerging additive manufacturing concepts and techniques for the processing of 2D/3D structures and integration of functional electronic components and devices on engineered geometries. Topics related to functional materials, low-temperature processing, large area manufacturing, and electronic applications are within the scope of this symposium. Invited and contributed papers will discuss both the fundamental aspects underlying certain applications and the particular challenges regarding technology, fabrication processes, and reliability.

Research fields of interests are related but not necessarily limited to the following topics:

- Nanomaterials, inks, and substrates for 2D/3D additive manufacturing
- Additive manufacturing and characterization of 3D structures and geometries
- Printed electronics: materials, processes, and fabrication and characterization techniques
- Low thermal budget integration of functional inks and 2D/3D materials
- Multifunctional printed electronic devices: sensors, detectors, TFTs, antennas, PVs, batteries
- Hybrid electronics: merging printed electronics and additive manufacturing
Abstracts Due 07/16/2017
Proceedings Plan Planned: TMS Journal: Journal of Electronic Materials
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