|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Thermal Stable Ag-Ag Joints Bonded by Ultrasound-assisted Stress Migration Bonding
||Hao Zhang, Norio Asatani, Yukiharu Kimoto, Aiji Suetake, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma
|On-Site Speaker (Planned)
We introduce a Ag-Ag direct bonding process with the aid of ultrasonic bonding, which uses silver “Nano-volcanic eruption of Ag” caused by stress migration at 250 °C. Various preheating temperatures before the ultrasonic pulse and various sputtering methods such as direct current and radio frequency have also been evaluated. A novel bonding process which combines ultrasonic bonding and stress migration bonding (SMB) method is established. The bonding achieved die-shear strength of more than 50 MPa and a nearly-perfect voidless bonding interface. High temperature storage (HTS) test at 250 °C was used to evaluate the thermal-resist ability of bonded SMB joints. The results indicate that the bonded joints show no obvious changes in the interfacial morphology and the die-shear stress after HTS test for 1000 h is still higher than 30 MPa. The thermally-stable SMB joints can be applied to advanced devices such as thin-wafer multi-chip integrations and next-generation power devices.
||Planned: Supplemental Proceedings volume