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Meeting 2016 TMS Annual Meeting & Exhibition
Symposium Recent Advancement on Stretchable and Wearable Electronics
Presentation Title 3D Printing Liquid Metals at Room Temperature for Fabrication of Functional, Stretchable, and Soft Electronics
Author(s) Dishit P. Parekh, Collin Ladd, Michael Dickey
On-Site Speaker (Planned) Dishit P. Parekh
Abstract Scope Existing strategies for 3D printing of metals tend to be expensive, energy-intensive, and usually require high temperatures (for sintering metal powders) or low pressures (to avoid oxidation). These procedures are incompatible with polymers, organics, soft materials, and biological materials. We present an alternative system that utilizes low melting point alloys based on gallium as complements to the current materials for 3D printing applications. Despite having high surface tension and low viscosity, these metals form mechanically stable structures due to the formation of a thin (~3 nm thick) surface oxide. The oxide is passivating and forms rapidly and spontaneously on the surface of the metal. We utilize this property to print free-standing 3D liquid metal microstructures such as wires, fibers, interconnects, and stacked arrays of droplets at room temperature on soft surfaces using low dispensing pressures (~10s of kPa). The smallest components fabricated are ~10 Ám wide. These alloys are easy to print and offer the electrical and thermal benefits of metals. The ability to direct-print metals on flexible polymers at room-temperature is important for fabrication of soft, stretchable and flexible analogs to conventional rigid wires, electrical interconnects, electrodes, antennas, meta-materials and optical materials.
Proceedings Inclusion? Planned: TMS Journal: Journal of Electronic Materials

OTHER PAPERS PLANNED FOR THIS SYMPOSIUM

3D Printing Liquid Metals at Room Temperature for Fabrication of Functional, Stretchable, and Soft Electronics
A New Architecture for Flexible Large-area Electronic Systems
B-1: Printing of Graphene-coated Copper Nano-ink on Flexible Substrate Using Light Sintering Method
DFT Approach to Electronic and Optical Properties of Foldable and Stretchable Graphene
Flexible Copper Clad Laminate prepared by Roll-to-Roll Additive Manufacturing
Inkjet Printed Metal Oxide Thin Film Transistors
Laser Writing and Photonic Reduction of High Performance Supercapacitors on Flexible Substrates
Materials Integration for Flexible Electronics: Cu-interconnects, Supercapacitors
Mechanical Stability of Printed Metallizations on Polymer Substrates
New Paradigms for Enabling Printing of Flexible Optoelectronics through Engineered Metal-organic Inks and Direct Writing
Post Processing and In Situ Processing for Low Thermal Budget Integration of Electronic Materials on Flexible Substrates
RF Devices based on 2D Materials for Flexible and Wearable Electronics
Self-sensing Ionic Polymer-metal Composite Soft Robotic Actuator Integrated with Gallium-indium Alloy
Silver Nanowire Networks for Flexible Electromagnetic Interface Shields
Ultrasonic Spray Printing for High-performance Flexible Organic Field-effect Transistors and Hybrid Perovskite Solar Cells
Wearable Energy Storage Devices from Cotton T-shirts
Wireless Gas Sensing with NFC-enabled Mobile Device

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