|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Late News Posters
||PP-30: Synthesis of Functionally Graded (Cu, Cu-SiC) Nanocomposite Coating on Copper Substrate by Pulse Electrodeposition
||Swastika Banthia, Srijan Sengupta, Arijit Mitra, Siddhartha Das, Karabi Das
|On-Site Speaker (Planned)
The surface of engineering materials plays an important role in their performance. A functionally graded copper (Cu) and copper- silicon carbide (Cu-SiC) nanocomposite coating has been prepared by pulse electrodeposition (PED) technique. First, the microstructure of pure Cu as well as Cu-SiC nanocomposite coating as a function of electrodeposition parameters has been studied. Then, microstructurally graded pure Cu coatings have been deposited on Cu substrate followed by Cu-SiC nanocomposite coating. An attempt has been made to correlate the morphology of pure Cu as well as Cu-SiC coatings with the deposition parameters. The hardness and wear properties of the functionally graded nanocomposite coatings have been compared with those of the Cu-SiC monolayer coating.