|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI
||Effects of Cu Concentration on the Mechanical Reliability of the Sn-Ag-Cu/Ni Solder Joints–Solid-state Reaction
||Cheng-En Ho, Ming-Kai Lu, Pei-Tzu Lee, Wan-Zhen Hsieh
|On-Site Speaker (Planned)
Tin-sliver-copper (Sn-Ag-Cu) series of alloys with the Ag concentration ranging from 0–4 wt.% and the Cu concentration (x) ranging from 0–1 wt.% has become the most popular solder system in microelectronic packaging applications. In this study, the effects of Cu concentration (x) on the solid-solid reaction between Sn-3Ag-xCu alloy and electrolytic Au/Ni/Cu multilayer and the mechanical reliability were investigated via scanning electron microscopy, electron probe microanalysis, transmission electron microscopy, and high-speed ball shear test. The growth of intermetallic compounds (IMCs), including (Cu,Ni)<SUB>6</SUB>Sn<SUB>5</SUB> and (Ni,Cu)<SUB>3</SUB>Sn<SUB>4</SUB>, and the shear resistance of the Sn-3Ag-xCu/Au/Ni/Cu solder joints strongly depended on x. The residual Cu concentration in the solder played a remarkable role in determining the IMC species and thickness, affecting the mechanical properties of the solder joints. These investigations provided valuable information regarding the Cu concentration effect on the thermal reliability of the Sn-3Ag-xCu/Au/Ni/Cu reaction system.
||Planned: Supplemental Proceedings volume