|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Emerging Interconnect and Pb-free Materials for Advanced Packaging Technology
||New Concept Solders/Interconnects for 3D Packaging
||Kazuhiro Nogita, Christopher M. Gourlay, Mohd Arif Mohd Salleh, Guang Zeng, Yueqin Wu, Stuart D. McDonald
|On-Site Speaker (Planned)
Tetragonal Sn and hexagonal/monoclinic Cu6Sn5 have strong anisotropic properties, including hardness, elastic modulus, and coefficients of thermal expansion. One method of obtaining more isotropic properties in the bulk is to promote a large number of small grains of random orientation. Here we show an alternate approach using a unique concept to achieve higher reliability without any grain refinement or need for multi-grained solder alloys. This approach has the potential to provide microstructures suitable for 3D packaging in harsh conditions including higher operation temperatures, smaller interconnect areas, and extensive thermal cycling. Along with the new approach, fundamental data has been obtained as a proof-of-concept using synchrotron XRD, TEM, nano-indentation and in-situ synchrotron soldering observations as well as impact testing of solder joints.
||Planned: A print-only volume