|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Characterization of Minerals, Metals, and Materials
||Defect Structures in the Intermetallic Compounds Ag3Sn and Cu3Sn
||Haibo Yu, Yu Sun, Seok-Woo Lee, Paul Canfield, S. Pamir Alpay, Mark Aindow
|On-Site Speaker (Planned)
The intermetallic compounds Ag<SUB>3</SUB>Sn and Cu<SUB>3</SUB>Sn, were originally described as being iso-structural with the orthorhombic D0<SUB>a</SUB> (Cu<SUB>3</SUB>Ti-type) structure. In subsequent studies it was shown that equilibrium form of Cu<SUB>3</SUB>Sn is a long-period variant of the D0<SUB>a</SUB> structure. It has been established previously that the Ag<SUB>3</SUB>Sn is inherently ductile, whereas Cu<SUB>3</SUB>Sn exhibits very brittle behavior. In our studies we have used transmission electron microscopy investigate the defect structures that develop in the two phases. These observations are used to gain an insight into the different deformation micro-mechanisms that operate, and thus to elucidate the dramatic differences in ductility. In pseudo-binary Ag<SUB>3</SUB>Sn-Cu<SUB>3</SUB>Sn alloys we find that the Ag<SUB>3</SUB>Sn phase deforms mainly by dislocation glide, whereas the Cu<SUB>3</SUB>Sn phase deforms by twinning. These observations are compared with data from experiments on deformed samples of pure Ag<SUB>3</SUB>Sn and Cu<SUB>3</SUB>Sn, to reveal the roles of solute atoms and heterophase interfaces on the deformation mechanisms.
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