|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV
||Low-temperature Pressure-less Silver-to-silver Direct Bonding at Ambient Condition: Part I-Experimental Study
||Shijo Nagao, Chulmin Oh, Shih-kang Lin, Hao Zhang, Emi Yokoi, Takeshi Ishibashi, Katsuaki Suganuma
|On-Site Speaker (Planned)
Nanoscale experimental study has been conducted to clarify the atomistic mechanisms in low-temperature direct-bonding between Ag thin-films. These Ag-based bonding technologies either stress migration in thin films, or sintering of nano/micro-particles are attracting much attention, particularly for electronic interconnections like die-attach for high-temperature power devices. It is widely recognized that the bonding quality depends on the bonding process parameters of temperature, pressure, and environmental gas. In particular, the role of oxygen is relevant for Ag bonding. Here we presents experimental evidences of Ag-O system on surfaces and interfaces in Ag microstructures with using transparent electron microscopy. Nano-scale Ag particles are nucleated in amorphous Ag-O layer covering the bonding front surface of growing Ag grains, and agglomerate to grow the original grains. Our study reveals that oxidation and reduction on Ag surface is essential for various Ag bonding and sintering processes in electronic packaging.
||Planned: A print-only volume