|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XV
||Rapid Formation and Phase Transformation of Intermetallic Compounds Interconnection under Stress Current at Ambient Temperature
||Yanhong Tian, Baolei Liu
|On-Site Speaker (Planned)
Three-dimensional (3D) package is considered as the predominant interconnection technology in the coming era of semiconductor industry due to its minimized size, high density, excellent electrical-mechanical performance and low power consumption. In this paper, the phase transformation and grain orientation of Cu-Sn and Cu-In intermetallic compounds under low temperature bonding process was investigated, meanwhile, a new approach of rapid fabrication of intermetallic compounds (IMCs) solder joints at ambient temperature was proposed. Firstly, microstructure evolution and phase transformation of Cu-Sn and Cu-In intermetallic compounds (IMCs) in Cu/Sn/Cu and Cu/In/Cu joints formed by Solid-Liquid Interdiffusion (SLID) Bonding were investigated respectively. Secondly, a new method of rapid fabrication of intermetallic compounds (IMCs) solder joints by strong electric current at ambient temperature was investigated. High shear strength Cu/Sn/Cu solder joints were obtained by using different electric currents for only about 0.2s. The Sn foils with the thickness of 10μm were used as solders.
||Planned: A print-only volume