|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Applications of Process Engineering Principles in Materials Processing, Energy and Environmental Technologies: An EPD Symposium in Honor of Professor Ramana G. Reddy
||Innovations and Insights in Fluid Flow and Slime Adhesion for Improved Copper Electrorefining
||Weizhi Zeng, Michael L Free, Shijie Wang
|On-Site Speaker (Planned)
Copper electrorefining is an old technique that is generally performed in electrolytic cells with a bottom inlet and top outlet that are convenient for electrolyte flow control. Nevertheless, this configuration cannot effectively direct electrolyte flow to the regions between electrodes, which results in weak convection and inadequate delivery of chemical species and additives. Innovations in electrorefining cell design can improve electrolyte flow for improved cathode quality as will be discussed in this paper, along with associated current distribution, species transport, fluid flow field, and particle movements that were simulated based on finite element modeling. The resulting fluid flows in cells can transport suspended slime particles to the cathode where they can become incorporated as impurities. The concentration of suspended slime particles is inversely related to slime adhesion, which is strongly influenced by slime particle sintering, and sintering is related to temperature and slime particle composition. Thus, the combination of innovative fluid flow and slime particle sintering can play important roles in improving cathode quality as will be discussed in this paper.
||Planned: Stand-alone book in which only your symposium’s papers would appear (indicate title in comments section below)