|About this Abstract
||2017 TMS Annual Meeting & Exhibition
||Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XVI
||Kinetics of Isothermal Reactive Diffusion between Solid Cu and Liquid Sn-base Alloys
||Minho O, Masanori Kajihara
|On-Site Speaker (Planned)
Sn-base solders are widely used in the electronics industry. If a Cu-base conductor is interconnected with the Sn-base solder, Cu-Sn compounds are formed by reactive diffusion at the interconnection during soldering. The growth behavior of the Cu-Sn compounds may be affected by alloying elements in the Sn-base solder. To examine such effects, kinetics of the reactive diffusion between solid Cu and liquid Sn-base alloys was experimentally observed by an isothermal bonding (IB) technique. In the IB technique, the solid and liquid metals are separately preheated at the same temperature as the isothermal annealing temperature in a vacuum. After sufficient preheating, the solid and liquid metals are bonded with each other and then annealed immediately. Thus, unlike immersion and soldering techniques, the temperatures of the solid and liquid metals are equivalent and remain constant during preheating, bonding and annealing in the IB technique.
||Planned: Supplemental Proceedings volume