| About this Abstract |
| Meeting |
2010 TMS Annual Meeting & Exhibition
|
| Symposium
|
Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
| Presentation Title |
Interfacial Reactions of Sn3.0Ag0.5Cu Solder with Cu-Mn UBM during Aging |
| Author(s) |
Chien-Fu Tseng, Jenq Gong Duh |
| On-Site Speaker (Planned) |
Chien-Fu Tseng |
| Abstract Scope |
Cu UBM has been widely used as surface finish in the filp chip technology. The major disadvantages of Cu UBM are fast consumption of copper, rapid growth of IMCs and formation of Kirkendall voids. Recently, minor element addition into Cu UBM has been observed to suppress the formation of Cu-Sn IMCs at the interface. In this study, different Mn content (1-20 at.%) were added into Cu UBM by sputtering technique. With higher Mn concentration in Cu-Mn UBM, a new phase, MnSn2, was formed between Cu6Sn5 and Cu-Mn UBM. MnSn2 may be a diffusion barrier to reduce the interfacial reaction and reduce the formation of kirkendall voids. The detailed mechanism of the IMC formation will be probed and discussed. |
| Proceedings Inclusion? |
Planned: Journal of Electronic Materials |