|About this Abstract
||2016 TMS Annual Meeting & Exhibition
||2016 Functional Nanomaterials: Emerging Nanomaterials and Techniques for 3D Architectures
||The Impact of Interfaces on the Integration of 2D Materials into Nanoelectronics
||Stephen J. McDonnell, Keren M. Freedy, Angelica Azcatl, Christopher M. Smyth, Rafik Addou, Christopher L. Hinkle, Robert M. Wallace
|On-Site Speaker (Planned)
||Stephen J. McDonnell
The last decade has seen fevered interest in 2D materials for nanoelectronics. Previous studies had focus primarily on tribological and energy storage applications due to the weak van der Waals bonding that exist between the atomic layers. These materials, which include graphene, hexagonal boron nitride, and the plethora of transition metal dichalcogenide combinations, have electronic structures exhibiting metallic, semiconducting, and insulating properties. This promises devices with scalability to the atomic limit combined with defect free interfaces. Realizing this promise has not proved trivial. Industry standard chemistry based processing techniques such as atomic layer deposition are highly dependent on the availability of surface dangle bonds, absent in layered materials. Process residues such as photo-resists can impact device performance. Metal depositions can result in the formation of unexpected interface compounds that can dominate the contact behavior. Presented will be a summary of our work on identifying and overcoming these challenges.