|About this Abstract
||2018 TMS Annual Meeting & Exhibition
||Advanced Microelectronic Packaging, Emerging Interconnection Technology, and Pb-free Solder
||Observations of Microstructure Evolution and Damage during Creep Testing and Thermal Loading of SAC 305 Solder Alloys
||Tianhong Gu, Grey Chen, Chris Gourlay, Ben Britton
|On-Site Speaker (Planned)
The reliability of solder joints is affected significantly by thermomechanical properties such as creep and thermal fatigue. In this work, the creep of directionally solidified SAC305 with a controlled <110> fibre texture is investigated under constant load testing at a range of temperatures. The secondary creep strain rate, the dominating creep mechanism, and its temperature dependence are explored. Electron backscatter diffraction (EBSD) at different stages of the creep curve are used to study the evolution of crystal orientations and recrystallization and reveal microstructural mechanisms. The local coarsening of eutectic intermetallics (IMCs) in SAC305 and their role as strain concentrators is explored. These observations are extended to thermal shock of solder joints.
||Planned: Supplemental Proceedings volume